Book: Measurement and Evaluation Methods of Resin Hardness and Curing Behavior

**Part 1**: Quantification Technology for the Curing Reactivity of Thermosetting Resins Using Reaction Rate Equations Masaki Yoshii, Seiro Japan Co., Ltd. This section introduces representative reaction evaluation techniques for thermosetting resins and presents various reaction rate equations as methods for quantifying the obtained reaction characteristics. **Part 2**: Analysis and Evaluation Techniques for the Curing Behavior of Thermosetting Resins Using Thermal Analysis and Viscoelastic Measurement Nobuaki Okubo, Hitachi High-Tech Science Corporation This section explains the measurement of the curing behavior of thermosetting resins using DSC, TG, TMA, and DMA, as well as the analysis of the cured products, and introduces case studies of UV-curable resins analyzed by photochemical reaction DSC. **Part 3**: Measurement and Evaluation Techniques for the Curing Behavior of Thermosetting Resins Using Dielectric Analysis (DEA) Osamu Tsukamoto, Netch Japan Co., Ltd. This lecture introduces the basics of dielectric analysis, practical measurement techniques, and application examples. **Part 4**: Analysis of Curing Reactions of Cured Resins Using FT-IR and Raman Spectroscopy Mamoru Komatsu, Thermo Fisher Scientific Inc. This course covers the fundamentals of infrared and Raman spectroscopy, including equipment, sampling methods, and analysis examples.