9th International Car Electronics Technology Exhibition - Car Electronics JAPAN

Thermal management for miniaturized electronic components! Conducts heat with low load and low stress even on steps and rough surfaces.

The BERGQUIST GAP PAD TGP HC5000, which has improved thermal conductivity, has been introduced to the GapPad series, ideal for thermal management of electronic components and substrates. With a thermal conductivity of 5.0 W/m·K, this product has high conformability and excellent wettability, allowing it to efficiently conduct heat even on uneven surfaces and rough textures. Additionally, its low compression load minimizes stress on components and substrates during assembly. 【Features】 ■ Easy-to-handle sheet with high filling capability ■ Excellent thermal properties even under low loads ■ Reduces joint temperature, contributing to improved device performance *For more details on the GapPad series, please refer to the catalog.

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After curing, it provides a high-efficiency thermal interface without air gaps.

It is a two-component mixed type thermal conductive gap filling material. Since it can be applied with a dispenser, it offers high freedom of shape and does not put stress on components or substrates during assembly.

• Printed Circuit Board
• Electrical equipment parts

Thermal conductive adhesive

Berkquist's liquid adhesive can mechanically bond components to heat sinks with thermal transfer performance without the need for additional fasteners. Additionally, it is in a gel-like viscous state that has not yet cured, making it suitable for both automatic and manual injection.

• glue

Hi-Flow Phase Change Material

Hi-Flow is an excellent phase change material that replaces grease as the thermal interface between the CPU or power device and the heat sink.

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Gap Pad sheet-type thermal interface material

At Henkel, we have developed and provide the BERGQUIST GAP PAD series, a sheet-type interface material that is easy to install and has high thermal performance for thermal management of electronic components and substrates.

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Sil-Pad thermal conductive insulating material

Sil-Pad elastomer thermal interface materials come in dozens of varieties, each exhibiting its own unique structure, properties, and performance. Sil-Pad thermally conductive insulating materials are available in various shapes and are used in a wide range of electronic applications as a clean and efficient alternative to mica, ceramics, or grease.

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We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Speaker] Jun Ishikawa, Professor at the Graduate School of Business Administration, Rikkyo University, and Vice President of Rikkyo University [Key Lecture Content] This lecture will provide a clear explanation of the most effective leadership in the VUCA era, focusing on shared leadership based on the latest research. Specifically, it will discuss how everyone can exhibit effective leadership to improve workplace and team outcomes, and how anyone can develop effective leadership skills through training. Additionally, it will explain what is necessary to foster shared leadership in workplaces and teams from both individual and organizational perspectives. To continue achieving results in the VUCA era, let’s challenge traditional views of leadership and explore new leadership concepts. [Lecture Items] 1. Characteristics of the VUCA Era 2. What is Shared Leadership? 3. Effects of Shared Leadership 4. Effectiveness of Personal Leadership Theories 5. How to Foster Shared Leadership in Workplaces and Teams 6. Q&A *This seminar will be held via Zoom meeting.*

[Speaker] PwC Advisory LLC Senior Manager Toshiya Nakamura [Key Lecture Content] The expected roles of smart meters (AMI) and DER (Distributed Energy Resources) in power systems are increasing both domestically and internationally. The DISTRIBUTECH conference, one of North America's largest exhibitions and conferences for transmission, distribution, and energy-related technologies, will be held in early February 2026 in San Diego, North America. Numerous power companies and manufacturers introduced the latest trends regarding the next-generation smart meter systems AMI 2.0 and the utilization of DER. In this lecture, I will share the latest trends in the utilization of smart meters and DER in the decentralization of power systems gained through participation in DISTRIBUTECH. [Lecture Items] 1. Overview of DISTRIBUTECH 2. Latest trends in AMI 2.0 3. Latest trends in DER utilization 4. Considerations for the utilization of smart meters and DER 5. Q&A / Business card exchange

[Speaker] Mr. Li Qiangfu, Senior Researcher, Planning and Research Department, Fourin Inc. [Lecture Topics] 1. Tesla Master Plan: Progress of Existing and New Businesses 2. Strategy as a Technology Trendsetter 3. Initiatives in Purchasing and Supply Chain 4. Efforts as an IT Service Platform Provider 5. Competition with Chinese Companies and Strategies to Differentiate 6. Q&A / Business Card Exchange