9th International Car Electronics Technology Exhibition - Car Electronics JAPAN

Thermal management for miniaturized electronic components! Conducts heat with low load and low stress even on steps and rough surfaces.

The BERGQUIST GAP PAD TGP HC5000, which has improved thermal conductivity, has been introduced to the GapPad series, ideal for thermal management of electronic components and substrates. With a thermal conductivity of 5.0 W/m·K, this product has high conformability and excellent wettability, allowing it to efficiently conduct heat even on uneven surfaces and rough textures. Additionally, its low compression load minimizes stress on components and substrates during assembly. 【Features】 ■ Easy-to-handle sheet with high filling capability ■ Excellent thermal properties even under low loads ■ Reduces joint temperature, contributing to improved device performance *For more details on the GapPad series, please refer to the catalog.

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After curing, it provides a high-efficiency thermal interface without air gaps.

It is a two-component mixed type thermal conductive gap filling material. Since it can be applied with a dispenser, it offers high freedom of shape and does not put stress on components or substrates during assembly.

• Printed Circuit Board
• Electrical equipment parts

Thermal conductive adhesive

Berkquist's liquid adhesive can mechanically bond components to heat sinks with thermal transfer performance without the need for additional fasteners. Additionally, it is in a gel-like viscous state that has not yet cured, making it suitable for both automatic and manual injection.

• glue

Hi-Flow Phase Change Material

Hi-Flow is an excellent phase change material that replaces grease as the thermal interface between the CPU or power device and the heat sink.

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Gap Pad sheet-type thermal interface material

At Henkel, we have developed and provide the BERGQUIST GAP PAD series, a sheet-type interface material that is easy to install and has high thermal performance for thermal management of electronic components and substrates.

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Sil-Pad thermal conductive insulating material

Sil-Pad elastomer thermal interface materials come in dozens of varieties, each exhibiting its own unique structure, properties, and performance. Sil-Pad thermally conductive insulating materials are available in various shapes and are used in a wide range of electronic applications as a clean and efficient alternative to mica, ceramics, or grease.

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We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

【Seminar Overview】 The construction industry faces many challenges, including labor shortages, regulations on working hours, and the need for operational efficiency. Additionally, the aging workforce presents significant issues, and there is a concerning trend of high turnover rates among younger employees who are supposed to carry on the skills and knowledge. In this seminar, we will discuss the causes of turnover based on case studies and explain key points on how advancing IT can help reduce turnover rates.

Date: October 7, 2025 (Tuesday) to October 10, 2025 (Friday) - 4 days Opening Hours: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Halls 4-8 Booth Number: 7-126 Exhibited Machines: ■ Quantitative Molding → Deep Drawing Automatic Feeding Line VEMAG (Germany) Robot500 ... Quantitative Filling Machine VEMAG (Germany) ASV811 ... Cutting Device FANUC (Japan) Parallel Link Robot SEALPAC (Germany) RE23 ... Deep Drawing Vacuum Gas Replacement Packaging Machine FANUC (Japan) Collaborative Robot SMC (Japan) Hand ■ SEALPAC (Germany) Amax ... Fully Automatic Gas Replacement Tray Sealer * Digital Printing Top Film Videojet (Japan) UV Laser Marker Nikka Densok (Japan) Seal Leak Testing Device M-flex ... Semi-Automatic Rotating Gas Replacement Tray Sealer ■ Supervac (Austria) GK169B ... Belt-Type Chamber Machine GK402B ... Belt-Type Chamber Machine ■ Packaging Materials Hotel Pantry * Please note that the exhibited machines may change without prior notice.

【Exhibition Information】 Exhibition Name: Food Processing Technology Expo 2025 Date and Time: November 14, 2025 (Friday) 10:30 AM - 4:30 PM *Free entry and exit, pre-registration required Location: Osaka Industry Creation Center - We will showcase technical products using the factory deodorant "Deofure." - We will display the tofu defoamer "Tofu Up." - Other aromatic technical products will also be exhibited. *For more details, please refer to the materials.

Techne Measurement Co., Ltd. will exhibit at the "Kyushu Semiconductor Industry Exhibition" held at Marine Messe Fukuoka, Halls A and B, on October 8 (Wednesday) and 9 (Thursday), 2025. This time, we will showcase dew point meters, moisture meters, oxygen concentration meters, anemometers, temperature and humidity meters, and temperature and humidity/dew point calibrators for the semiconductor industry. Please be sure to visit the Techne Measurement booth. 　＿＿＿　　　　　　　＿＿＿ 　＼ ┌┴──────┴┐ ／ 　／ │Visitor Gifts│ ＼ 　￣ └────────┘ ￣ 　　 We are giving away the very popular 330ml spherical bottle of cute "Moisture Water"! Visitors who exchange business cards will receive water in the shape of our official character "Moisture" as a gift♪ It's a very cute bottle, so be sure to get one! Please be sure to visit the Techne Measurement booth.