9th International Car Electronics Technology Exhibition - Car Electronics JAPAN

Thermal management for miniaturized electronic components! Conducts heat with low load and low stress even on steps and rough surfaces.

The BERGQUIST GAP PAD TGP HC5000, which has improved thermal conductivity, has been introduced to the GapPad series, ideal for thermal management of electronic components and substrates. With a thermal conductivity of 5.0 W/m·K, this product has high conformability and excellent wettability, allowing it to efficiently conduct heat even on uneven surfaces and rough textures. Additionally, its low compression load minimizes stress on components and substrates during assembly. 【Features】 ■ Easy-to-handle sheet with high filling capability ■ Excellent thermal properties even under low loads ■ Reduces joint temperature, contributing to improved device performance *For more details on the GapPad series, please refer to the catalog.

• Other process controls

After curing, it provides a high-efficiency thermal interface without air gaps.

It is a two-component mixed type thermal conductive gap filling material. Since it can be applied with a dispenser, it offers high freedom of shape and does not put stress on components or substrates during assembly.

• Printed Circuit Board
• Electrical equipment parts

Thermal conductive adhesive

Berkquist's liquid adhesive can mechanically bond components to heat sinks with thermal transfer performance without the need for additional fasteners. Additionally, it is in a gel-like viscous state that has not yet cured, making it suitable for both automatic and manual injection.

• glue

Hi-Flow Phase Change Material

Hi-Flow is an excellent phase change material that replaces grease as the thermal interface between the CPU or power device and the heat sink.

• Other process controls

Gap Pad sheet-type thermal interface material

At Henkel, we have developed and provide the BERGQUIST GAP PAD series, a sheet-type interface material that is easy to install and has high thermal performance for thermal management of electronic components and substrates.

• Other process controls

Sil-Pad thermal conductive insulating material

Sil-Pad elastomer thermal interface materials come in dozens of varieties, each exhibiting its own unique structure, properties, and performance. Sil-Pad thermally conductive insulating materials are available in various shapes and are used in a wide range of electronic applications as a clean and efficient alternative to mica, ceramics, or grease.

• Other process controls

[Speaker] Kyoko Kawasaki, President and CEO, First Innovatec Co., Ltd. [Purpose of the Event] In the VUCA era, where market changes are rapid and product life cycles are shortening, research and development departments are required to be more aware than ever of "market perspective" and "customer value" in their development processes. This means that it is not enough to simply deepen technology; it is essential to elevate it to "sellable" and "useful" technology through a new way of thinking. This seminar will explain the concepts and methods for engineers and R&D leaders to incorporate a marketing perspective and set valuable research and development themes. [Knowledge to be Acquired] - Basic marketing knowledge that engineers should grasp - How to utilize marketing frameworks aimed at STP (Segmentation, Targeting, Positioning) - The process of transforming technical ideas into research and development themes that connect to business

In the world, there are more information systems than there are companies, but the number of systems that truly "help with a company's business operations" in a meaningful way is limited. To address this challenge, our company has developed and evolved our unique supply chain solutions, the "Φ-Conductor Series" and "Φ-Pilot Series." Since our establishment, we have upheld the philosophy of "together with our customers, for our customers," and, unlike many IT vendors, we have consistently focused on the effectiveness of our implementations, steadily building our track record. Therefore, on the occasion of our 25th anniversary, we have decided to hold an event where customers who have implemented our solutions will share their experiences regarding the effectiveness of the implementation and any challenges they faced. The companies presenting will include a diverse range of six user companies, primarily from the food industry. Additionally, at the concurrently held exhibition, we will showcase our original lineup, the "Φ-Pilot Series" and "Φ-Conductor Series," along with add-on features and optional products related to φ-Pilot that our partner companies are working on. We warmly invite you to attend this event.

Softex Corporation will be exhibiting at the "40th Electro Test Japan" held at Tokyo Big Sight. At our booth, we will showcase the micro-focus X-ray inclined CT inspection device "SHRα," which demonstrates its power on components such as implemented multilayer boards and three-dimensional structures that have been difficult to inspect until now. [Booth Number: East Hall 5 E15-17] We sincerely look forward to your visit.

Our company will be exhibiting at the "Yonyaku Medical Fair 2025." We sincerely look forward to your visit.

Tohsan Electronic Equipment is exhibiting our product "ePI-09" used in calligraphy robots and "T-Shirt-kun" related goods at MOBIO (Monozukuri Business Center Osaka). Period: November 4, 2025 - November 27, 2025 Location: MOBIO The "ePI-09" is one of the smallest in the industry, yet it features 4-axis synchronous control and various interpolation functions (such as linear, arc, and helical). It is compatible with Raspberry Pi, has a rich API, and enables low-cost and short-term development. It can be stacked with up to 8 units and supports control of up to 32 axes. Additionally, at the "T-Shirt-kun" related exhibition, we are showcasing actual printed T-shirts and flyers with coupons. You can closely see the quality of the products and the image of their use. We hope you stop by!