Gap Pad sheet-type thermal interface material

Henkel Japan Corporation's Electronics Division, a Japanese subsidiary of the German chemical and consumer goods manufacturer Henkel, will exhibit at the "9th International Car Electronics Technology Exhibition" (Dates: January 18-20, 2017, Venue: Tokyo Big Sight) and will unveil new products from its thermal management brand BERGQUIST for the first time. At the Henkel Japan booth, the focus will be on the two-component, thermally conductive gap filling material: Gap Filler, which can be applied using a dispenser. The booth will showcase the extensive adoption record of BERGQUIST thermal management products, a diverse lineup including development products, and new sheet-type gap filling material: Gap Pad HC5.0. Demonstrations of the dispenser equipment and hands-on application experiences with air guns will be conducted regularly, providing a total solution that encompasses not only product selection but also the manufacturing process. Additionally, the booth will introduce conductive adhesives, underfill materials, and Technomelt sealants for automotive applications, which are used in a wide range of car electronics and sensor components, including common rail fuel systems, safety devices, engine and powertrain management, infotainment, and lighting.