Free sample testing currently in progress

Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

• Circuit board processing machine

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

• Bonding Equipment

A dispenser compatible with all hot melt materials has finally arrived!

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

• Circuit board processing machine

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

• Assembly Machine

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others

• Bonding Equipment

【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

• Assembly Machine

World-class 0.001mg / Successful high-speed coating! Versatility in dispensing processes across various industries

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin　　　　　　　　　　　　　　 Others

• Special Pump

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)