Ultra-Precision dispensing Device MsL [Smartphone Component Assembly/Flip Chip]

Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp

Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp