Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors

Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

• Circuit board processing machine

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

• Bonding Equipment

A dispenser compatible with all hot melt materials has finally arrived!

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

Attention smartphone component manufacturers and PCB assembly manufacturers! We are offering a free technical document featuring examples of improvements using the jet dispense method.

This document provides detailed foundational knowledge and mechanisms for solving dispensing position issues, accommodating uneven substrates, and improving yield by switching from the "screen printing method" to the "solder jet dispense method." It serves as a textbook-like resource that can address various problems faced by production sites. 【Target Audience】 Printed circuit board manufacturers, various module manufacturers, implementation in three-dimensional structures, FPC manufacturers, etc. 【Contents】 ■ Advantages / Disadvantages of the screen printing method ■ List of technologies made possible by jet dispensers ■ List of applied products (target applications) *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

• Circuit board processing machine

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

• Assembly Machine

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others

• Bonding Equipment

【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

• Assembly Machine

World-class 0.001mg / Successful high-speed coating! Versatility in dispensing processes across various industries

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin　　　　　　　　　　　　　　 Others

• Special Pump

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

On September 11, 2025, AC Tasarim, a cable blade manufacturer, and our company signed a sales agency agreement for Japan. This was also announced in the company's press release and on social media. Founded in Turkey in 2003, AC Tasarim manufactures flexible EMI cable shields (copper braid), polyester braid, meta-aramid braid (Nomex cable sleeves), flat copper braid busbars/ground braids, all AA59569-coded copper braids, and released AeroBraid in 2025, the world's lightest EMI braid. All manufactured copper braids are certified to military standards. AC Tasarim products hold key certifications including VDE/VG certification, German Federal Armed Forces certification, NATO NSN coding, AS9100 quality certification, and JOSCAR certification. Cable braids and EMI shielding products, essential for wire harnesses in the aerospace and defense industries, are becoming increasingly difficult to source as demand rises. TC Tasarim products are stocked by manufacturers and distributors to ensure quick response times.

Starting from September 22, 2025 (Monday), we will begin accepting orders for five new lineups tailored to various applications in the "N-SELECT" series of transport vehicles. In this new development, we will introduce the following five models that maintain the basic performance of the traditional N-SELECT while addressing more specialized needs: SC (Super Carrier) - Based on the traditional N-SELECT, this model is specialized for transporting immobile and accident vehicles. It is ideal for the automotive maintenance and towing industry. RC (Racing Carrier) - Designed with a gentle loading and unloading angle, this model is perfect for transporting sports cars and lowered vehicles. TP (Transporter) - A standard model optimized for the transportation of general passenger vehicles, suitable for a wide range of industries. ONE (Single Vehicle Loading Model) - A simple and efficient design dedicated to loading one vehicle. Recommended for small-scale transport and individual entrepreneurs. RS (Rescue) - A single vehicle loading model equipped with a crane, enhancing its capability to respond in accident scenes and tight spaces. With these lineups, N-SELECT evolves into a product group that meets a wider variety of on-site needs. We will continue to promote product development that reflects the voices from the field as the "preferred transport vehicle."