Free introductory seminar for semiconductor-related equipment analysis simulation software - held regularly!

For reducing man-hours and costs! Capable of various simulations such as thin film generation, sputtering, and plasma etching. Support after implementation is also reliable.

Our company specializes in analysis software for semiconductor-related equipment. We offer a lineup of rarefied fluid analysis software and plasma analysis software, which are actively used in simulations for organic EL and magnetron sputtering. This is for those who are struggling with "wanting to develop new products," "wanting to create and verify actual equipment during product improvements," or "wanting to conduct preliminary verification and comparative verification with equipment." Additionally, since these are in-house developed products, we provide extensive support even after implementation. 【Lineup / Features】 《Rarefied Fluid Analysis Software 'DSMC-Neutrals'》 ■ Supports unstructured meshes, allowing for calculations of complex shapes ■ Capable of simulating gas flow throughout the entire equipment 《Plasma Analysis Software 'Particle-PLUS'》 ■ Capable of low-pressure plasma simulations ■ Useful for research, development, and manufacturing of devices and materials using plasma *For more details, please refer to the materials. Feel free to contact us as well.

• Contract Analysis
• Other analyses

Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).

**Features** - Adopts unstructured mesh, allowing for calculations that accurately reflect the complex shapes of actual devices. - High parallel efficiency enables quick computation results even for large-scale geometries. - Utilizes a particle method, ensuring convergence solutions even with poor-quality computational grids, unlike fluid models. - Comprehensive technical support ensures that even those new to simulations or busy with experiments can reliably achieve results. **Supports Various Cases** - Simulation of rarefied gas flow within a vacuum chamber. - Simulation of thin film generation in semiconductor manufacturing. - Chemical vapor deposition (CVD), organic light-emitting diode (OLED), molecular beam epitaxy (MBE). - Film deposition simulations involving chemical reactions, such as CVD. **Outputs Various Calculation Results** - Calculations of chemical reactions. - Calculation of chemical reactions from Arrhenius-type reaction data. - Calculations of dissociation, recombination, and molecular (atomic) exchange reactions. - Ability to set multiple reaction equations on the GUI. *For more details, please refer to the catalog or feel free to contact us.*

• Contract Analysis
• Other analyses

"Particle-PLUS" is a plasma analysis software suitable for simulations such as plasma reaction furnaces and chemical vapor deposition (CVD).

Particle-PLUS is a plasma and rarefied fluid analysis software that uses the particle method. It is effective for research, development, and manufacturing of devices and materials using plasma. It is also capable of analyzing advanced physical models such as dual-frequency CCP and external circuit models. With comprehensive support, even those new to simulation or busy with experiments can reliably achieve results. The software employs a particle model to analyze plasma, using the PIC/MC (Particle In Cell / Monte Carlo) method to track the motion of particles representing electrons and ions. Additionally, depending on the target plasma density, it efficiently switches between implicit methods for relatively high densities and explicit methods for low densities, allowing for effective solutions even with complex models. It excels in plasma simulations of low-pressure gases, where fluid modeling is particularly challenging. In addition to standard functions for CCP, ICP, and magnetron sputtering calculations, customization to fit the customer's equipment is also available.

• Other analyses

This is simulation software that makes it possible to analyze the arc plasma of automotive spark plugs, which was previously difficult.

VizSpark is an arc plasma simulation software developed by Esgee Technologies in the United States, founded by Professor Raja from the University of Texas at Austin, an expert in plasma simulation. It has the most extensive track record in the analysis of spark plugs and circuit breakers, with many case studies presented at academic conferences. In Japan, it has a strong track record primarily among complete vehicle manufacturers and internal combustion engine-related manufacturers, and it supports the analysis of devices such as: - Circuit breakers - Atmospheric pressure discharge - Ignition plugs (spark plugs) - Plasma torches (plasma jets) - Welding - Thermal spraying - High-intensity lamps

• Engine parts
• Other analyses
• Contract Analysis

Dilute fluid analysis software 'DSMC-Neutrals' that also supports 'shower head type CVD' analysis.

Simulation Analysis of Gas Flow in Showerhead-Type CVD Equipment Initially compatible with various simulations 【Features】 ■ By adopting a non-structured mesh, it is possible to compute the exact shape of complex actual equipment. ■ High parallel efficiency allows for quick computation results even for large-scale shapes. ■ Since a particle method is used, unlike fluid models, convergence solutions can be obtained even with poor quality computational grids. ■ With comprehensive technical support, even those new to simulations or busy with experiments can reliably achieve results. ◆ Compatible with various cases ◆ - Simulation of rarefied gas flow in a vacuum chamber - Simulation of thin film generation in semiconductor manufacturing - Simulation of thin film generation in semiconductor manufacturing such as Chemical Vapor Deposition (CVD), Organic Light Emitting Diodes (OLED), and Molecular Beam Epitaxy (MBE) ◆ Outputs various computation results ◆ - Calculation of chemical reactions - Calculation of chemical reactions from Arrhenius-type reaction data - Calculation of dissociation, recombination, and molecular (atomic) exchange reactions - Multiple reaction equations can be set up on the GUI *We also offer contract analysis, so please feel free to contact us.

• Other analyses

This is simulation software that makes it possible to analyze arc plasma in automotive spark plugs, which was previously difficult.

VizSpark is an arc plasma simulation software developed by Esgee Technologies in the United States, founded by Professor Raja from the University of Texas at Austin, an expert in plasma simulation. It has the most achievements in the analysis of ignition plugs and circuit breakers, with many cases presented at academic conferences. In Japan, it has a strong track record primarily among complete vehicle manufacturers and internal combustion engine-related manufacturers, and it supports the analysis of devices such as: - Circuit breakers - Atmospheric pressure discharge - Ignition plugs (spark plugs) - Plasma torches (plasma jets) - Welding - Thermal spraying - High-intensity lamps

• simulator
• Contract Analysis
• Analysis Services

This software was developed by Professor Raja, an expert in plasma simulation at the University of Texas at Austin.

VizGlow is a general-purpose plasma simulation software developed by Esgee Technologies, Inc., founded by Professor Raja from the University of Texas at Austin, an expert in plasma simulation.

• simulator
• Contract Analysis
• Analysis Services

For simulating gas flow and thin film formation. Short computation time even for large shapes.

Our company specializes in analysis software for semiconductor-related equipment. We offer a lineup of rarefied fluid analysis software and plasma analysis software, which are effective for simulations of organic EL and magnetron sputtering. We can also accommodate customer needs. 【Product Lineup】 《Rarefied Fluid Analysis Software 'DSMC-Neutrals'》 ■ Supports unstructured meshes, allowing calculations for complex shapes ■ Capable of simulating gas flow throughout the entire equipment 《Plasma Analysis Software 'Particle-PLUS'》 ■ Enables low-pressure plasma simulations ■ Suitable for research, development, and manufacturing of devices and materials using plasma With these two systems, we can support various simulations in semiconductor manufacturing, including thin film generation, sputtering, and plasma etching. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Contract Analysis
• Other analyses

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session

[Lecturers] Accenture Ltd. Business Consulting Division Strategy Group, Technology Strategy Senior Manager Mamoru Yoneshige Accenture Ltd. Technology Consulting Division CDAI Consulting Principal Director Hiromichi Sugiyama [Key Lecture Content] While system development using AI agents is gaining attention, the challenges of AI-driven development in brownfield projects for enterprises with existing assets and technical debt are significantly greater. The introduction of coding support tools alone does not lead to company-wide transformation, and there exists a structural gap between the success of Proof of Concept (PoC) and the success of company-wide deployment. In this lecture, based on practical insights from Accenture's comprehensive support from strategy formulation to implementation, we will systematically explain the essentials for successful company-wide deployment, including the six principles of AI-driven development, categorization of brownfield types and deployment strategies, context engineering, the systematization of methodologies such as harness engineering and specification-driven approaches, promotion systems and in-house production strategies, and KPI design as a management agenda.