We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

For polishing various substrates and for fine burr removal in punched areas.

Super Finisher flat surface grinding allows even beginners to subtly differentiate the use of laps on the back side of the stamper original plate, and the environment is clean. The stamper back surface grinding device polishes the back side of the stamper using a lapping film. The clamping and unclamping of the workpiece is done by the operator, while roll grinding, pad grinding, brush cleaning, and air blowing are performed automatically. The various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. *Features* 【Stamper Back Surface Grinding Device】 - Various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. - The circumference of the roll grinding can be randomized with pad grinding. - Once the conditions are set, even beginners can operate it easily. 【Thin Plate Flat Surface Grinding Device】 - The film width can be selected according to the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched parts. - If a sub-table is provided, external setup can be done during processing time. *For more details, please download the materials or contact us.*

• Special Processing Machinery
• Other machine tools
• Wafer processing/polishing equipment

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

• Wafer processing/polishing equipment

Are you having trouble improving the accuracy of surface roughness? Sample tests for film polishing are available!

Are you having trouble improving surface roughness accuracy? Would you like to try the benefits of film polishing? You can polish quickly and easily without the hassle of the fine touch required in grinding with grinding wheels! 【For example, in the following cases】 ■ You want to improve roughness accuracy without worrying about changes in diameter or height dimensions. ■ You have performed grinding with grinding wheels, but it is still insufficient. – Final polishing is needed! ■ You want to finish with film polishing, skipping the grinding wheel process from the turning marks. ■ You want to roughen a surface that is too smooth. ■ You want to remove foreign substances attached to the surface. ■ You have tried various methods but they haven't worked well. ■ Polishing new materials or thin items seems unlikely to succeed without film polishing. *For more details, please request materials or view the PDF data from the download.

• Processing Contract

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

• Wafer processing/polishing equipment

Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.

The color filter protrusion correction device corrects protrusion defects on color filters. Using the protrusion height measurement system of this device, protrusions are polished to the allowable height through point grinding correction. It is also possible to automate the process by connecting an inspection device. In that case, based on the protrusion data, protrusion confirmation is performed, the shape of the protrusion is recognized, the polishing center position is corrected, and protrusion correction is reliably carried out. It is also possible to add a retry function. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

Maximizing the features of the wrapping tape makes the intended polishing easy.

As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)