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  3. NITTA DuPont Incorporated
  4. 【Technical Information】Grooving Process for CMP Polishing Pads
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  • Jan 16, 2019
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Jan 16, 2019

【Technical Information】Grooving Process for CMP Polishing Pads

NITTA DuPont Incorporated NITTA DuPont Incorporated
In selecting CMP pads, I will explain about one of the components, the groove processing. Generally, the surface of CMP pads is often grooved by the manufacturer before shipment. By applying groove processing to the surface of CMP pads, the following effects can be expected: 1. Improved retention and flowability of polishing slurry 2. Enhanced uniformity within the wafer surface and increased polishing rate 3. Prevention of wafer adhesion to the polishing pad surface 4. Discharge of processing debris and reaction byproducts The main specifications for groove processing typically include XY linear grooves, perforation grooves (through holes), and concentric grooves, and in some products, combinations of these may be possible. Various specifications for XY linear grooves, such as groove width and pitch, are available. We will select the optimal groove specifications tailored to your conditions, such as polishing equipment and processes, so please feel free to consult with us.
Examples of groove machining patterns
Examples of groove machining patterns
Comparison table of CMP pad product line and groove specifications.
Comparison table of CMP pad product line and groove specifications.
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Related product

IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

  • Other abrasives

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
  • Other abrasives

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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

  • Other abrasives

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Related catalog(1)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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NITTA DuPont Incorporated
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jan 09, 2026

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WiSAS 6th Anniversary Project Free Wi-Fi Environment Visualization Campaign

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Spline Network Co., Ltd. (Headquarters: Shibuya, Tokyo; President: Yoichi Yukino) will hold a free campaign for its WiSAS environmental scan service, one of its vulnerability assessment services, to commemorate the 6th anniversary of the release of the Wi-Fi Security Assurance Series (hereinafter referred to as WiSAS).

Jan 09, 2026

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"Comprehensive Review of DX Initiatives in 2025! Guide for Formulating DX Strategies for the Manufacturing Industry Towards 2026" Released

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The end of the year and the beginning of the new year is an excellent time to reflect on the past year and plan for the next. How did your company approach DX in 2025? Did you consider implementing a production management system? Did you take a step forward in utilizing AI? This article provides a practical guide to objectively evaluate your DX efforts in 2025 and to formulate specific strategies for 2026. Why not take the time during the year-end and New Year to carefully review your company's DX strategy? For more details, please see the related links.

Jan 09, 2026

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[Update] Regarding the discontinuation of basic authentication (SMTP AUTH) for Microsoft Exchange Online and the response of our products (EUC Automatic Email Option).

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Microsoft has announced that it will end support for Basic Authentication in Client Submission (SMTP Authentication) for Exchange Online between March and April 2026. Once this support is discontinued, sending emails using Basic Authentication (SMTP AUTH) will no longer be possible. Therefore, we would like to provide information regarding the affected features and planned responses in the TECHS series as follows. Reference: Microsoft Information Exchange Online to retire Basic auth for Client Submission (SMTP AUTH) Retirement of Basic Authentication for Exchange Online Please see the related links for more information.

Jan 09, 2026

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Publication of the magazine "Tekunowa" Vol. 5, which connects users with each other.

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On December 15, 2025 (Monday), we published the magazine "Tekunowa" Vol. 5. ■ About the publication "Tekunowa" "Tekunowa" is a magazine published twice a year with the concept of "connecting the 'circle' of manufacturing companies that are users of TechnoA." It is distributed to user companies of the production management system "TECHS" series, as well as to various companies that have connections with us through opportunities such as exhibitions and visits to our company. We have previously introduced the innovative initiatives of user companies and received positive feedback. For more details, please see the related link.

Jan 09, 2026

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