【Technical Information】Grooving Process for CMP Polishing Pads

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

• Other abrasives

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

• Other abrasives

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

• Wafer processing/polishing equipment
• Hand polishing and filing
• Other abrasives

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

• Other abrasives

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 / Intel Core 3 Processor N355 ● DDR5 4800MHz SODIMM ×1 (supports up to 16GB) (sold separately) ● HDMI 1.4 ×1, eDP 1.4b / LVDS ×1 ● Intel Ethernet Controller I226 (2.5GbE RJ-45 ×1), Realtek RTL8111H (1GbE RJ-45 ×1) ● Full-size mSATA / mPCIe ×1, M.2 2230 E-Key ×1 ● USB 3.2 Gen2[x1] ×2, USB 2.0 ×4 ● RS-232/422/485 ×2, RS-232 ×2 ● TPM 2.0, SATA 6Gb/s ×1, 4-bit GPIO, SMBus / I2C ×1 ● Fan-equipped heat sink available separately PICO-ASL4-FAN01: Heat sink with fan PICO-ASL4-HSK01: Heat sink PICO-ASL4-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure) * This is a model without an operating system.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.