Polishing pads optimal for primary polishing in mirror surface finishing.
The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.
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basic information
【Features】 - High productivity - High stable quality - High flatness
Price range
Delivery Time
※Delivery times may vary depending on the specifications, so please feel free to contact us.
Applications/Examples of results
Primary polishing of silicon wafers, etc. Flattening process.
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Company information
NITTA Dupont Inc. has been providing high-performance and high-quality products as a leading company in CMP polishing materials. Our range of applications spans semiconductor devices, silicon wafers, sapphire substrates, compound wafers such as SiC, GaN, LiTaO3, and glass substrates for displays. We will continue to contribute to technological innovation in nanotechnology by providing polishing solutions that realize the "creation of optimal surfaces" required by our customers. If you have themes such as "mirror finishing," "planarization," or "improving device reliability and yield," please consider precision polishing CMP!