[Technical Information] Groove Processing of CMP Polishing Pads 2

Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves.
We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use.
- Circular Groove
- Perforated Groove
- Radial Groove
- Spiral Groove
- XY Groove
- Arc Groove
When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge.
Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important.
Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Inquiry about this news
Contact Us Online