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  3. NITTA DuPont Incorporated
  4. [Technical Information] Groove Processing of CMP Polishing Pads 2
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  • Mar 07, 2019
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Mar 07, 2019

[Technical Information] Groove Processing of CMP Polishing Pads 2

NITTA DuPont Incorporated NITTA DuPont Incorporated
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Slurry diffusion effect due to pad groove processing
Slurry diffusion effect due to pad groove processing
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IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

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Related catalog(1)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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Apr 10, 2026

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