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  3. NITTA DuPont Incorporated
  4. Basic Knowledge: Types of Grinding Processes
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  • Jan 09, 2019
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Jan 09, 2019

Basic Knowledge: Types of Grinding Processes

NITTA DuPont Incorporated NITTA DuPont Incorporated
Polishing is a technique for flattening or creating a mirror finish on the surface of the workpiece. There are various principles and methods of polishing. - Chemical polishing: A method that primarily utilizes the etching action of chemical solutions to remove distortions from the workpiece surface. It does not use abrasive particles. Example: electrolytic polishing. - Mechanical polishing: A method that utilizes the cutting action of hard tools holding fine abrasive particles, to achieve flatness or a mirror finish on the workpiece. Example: grinding. - Chemical mechanical polishing (CMP): A composite process that combines the chemical dissolution action of polishing liquids with the mechanical removal action of abrasive particles. This method, represented by CMP, is used for flattening processes in semiconductor manufacturing, but it originally applied technology for mirror finishing of silicon wafers. The manufacturing processes for semiconductor devices require extremely high precision, reaching atomic levels of 0.1 micrometers. There are various other polishing methods, but the chemical mechanical polishing provided by Nitta Haas is one of the most precise ultra-precision polishing techniques.
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This explains the related grinding areas of Nitta Haas.

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IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

  • Other abrasives

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

  • Other abrasives

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
  • Other abrasives

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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

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Nanopure(TM)画像.jpg

Precision Grinding Slurry "Nanopure(TM)"

Polishing slurry that achieves nano-level surface quality.

The Nanopure(TM) series is a polishing slurry primarily used for primary polishing, secondary polishing, finishing polishing, and edge polishing of silicon wafers. The abrasive particles are made of high-purity colloidal silica, achieving excellent polishing performance through an optimal blend of additives. We will propose the most suitable product lineup based on your objectives and applications.

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Machplaner(TM)画像.jpg

Precision Grinding Slurry "Machplaner(TM)"

Polishing slurry that achieves a high polishing rate and good surface quality.

Through abrasive formulation technology and additive formulation technology based on colloidal silica, we achieve high polishing rates and high surface quality. We offer a lineup of products tailored to various polishing purposes and applications, including sapphire, glass, quartz, oxides, and resins. We will propose the optimal product lineup based on your objectives and applications.

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Related catalog(3)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

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Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

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How to Choose the Optimal Pressure Sensor - Steps to Correct Selection

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In applications where high-precision pressure measurement is required, it is necessary to select the optimal product from a wide range of options. Our extensive product lineup, consisting of pressure transducers, pressure transmitters, and digital pressure gauges, covers almost all application fields. So, what is the best solution for your needs? Before starting product selection, it is important to clearly define and organize the requirements. This will make product research more efficient and facilitate smoother communication. Generally, requirements can be classified into two categories: - Essential (Must) requirements - Desirable (Nice-to-have) requirements It can generally be said that having fewer essential requirements makes it easier to find solutions and helps keep costs and delivery times down. However, to define these requirements, it is first necessary to comprehensively analyze the fundamental issues. Only with this foundation can the analysis results be transformed into clear requirements for the desired product. This requires knowledge of the characteristics of the products being considered for purchase. For more information, please refer to the related links below!

Mar 02, 2026

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JOHNAN DMS's paper substrate assembly service

【March 27-28】JOHNAN DMS will exhibit at the DocoDemo Festival OSAKA.

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JOHNAN DMS will exhibit at the "DocoDemo Festival OSAKA" held in Namba, showcasing our "paper substrate mounting." This is a valuable opportunity to directly experience cutting-edge technology. Please feel free to consult us about any concerns regarding paper substrate mounting. ■ Venue: Namba Square, Nansan Street ■ Free admission. We look forward to your visit. DocoDemo Festival OSAKA: https://www.osaka.cci.or.jp/ddfes/ For information about our paper substrate mounting services, please visit our website. https://www.johnan.com/dms/mounting/paper/

Feb 28, 2026

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Column: Where there is a god that discards, there is a god that picks up.

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"There are gods who discard and gods who pick up." This was a phrase my father often used when we went to a model train shop that dealt in second-hand items. It is truly the case that gifts, which have continued to receive abnormally low evaluations even from antique dealers and recycling shops, have found their way to someone who genuinely wanted them, and it is indeed a joy, truly embodying the saying "there are gods who discard and gods who pick up." For more details, please see the link below. https://mbp-japan.com/hyogo/banyohkagaku/column/5215455/

Feb 28, 2026

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Student and School Print Goods Campaign

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[Duration: Ongoing until March 31, 2026] Let's preserve our "now" in form. Please feel free to inquire, whether it's for classes, clubs, school units, or even among friends.

Feb 28, 2026

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Goods campaign for stores and shops

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【Period: Ongoing until March 31, 2026】 Increase your store's fans! We will create original goods that will capture hearts! Please feel free to contact us.

Feb 28, 2026

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