Basic Knowledge: Types of Grinding Processes

Polishing is a technique for flattening or creating a mirror finish on the surface of the workpiece. There are various principles and methods of polishing.
- Chemical polishing: A method that primarily utilizes the etching action of chemical solutions to remove distortions from the workpiece surface. It does not use abrasive particles. Example: electrolytic polishing.
- Mechanical polishing: A method that utilizes the cutting action of hard tools holding fine abrasive particles, to achieve flatness or a mirror finish on the workpiece. Example: grinding.
- Chemical mechanical polishing (CMP): A composite process that combines the chemical dissolution action of polishing liquids with the mechanical removal action of abrasive particles. This method, represented by CMP, is used for flattening processes in semiconductor manufacturing, but it originally applied technology for mirror finishing of silicon wafers. The manufacturing processes for semiconductor devices require extremely high precision, reaching atomic levels of 0.1 micrometers.
There are various other polishing methods, but the chemical mechanical polishing provided by Nitta Haas is one of the most precise ultra-precision polishing techniques.

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