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  1. Home
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  3. NITTA DuPont Incorporated
  4. Basic Knowledge: Types of Grinding Processes
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  • Jan 09, 2019
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Jan 09, 2019

Basic Knowledge: Types of Grinding Processes

NITTA DuPont Incorporated NITTA DuPont Incorporated
Polishing is a technique for flattening or creating a mirror finish on the surface of the workpiece. There are various principles and methods of polishing. - Chemical polishing: A method that primarily utilizes the etching action of chemical solutions to remove distortions from the workpiece surface. It does not use abrasive particles. Example: electrolytic polishing. - Mechanical polishing: A method that utilizes the cutting action of hard tools holding fine abrasive particles, to achieve flatness or a mirror finish on the workpiece. Example: grinding. - Chemical mechanical polishing (CMP): A composite process that combines the chemical dissolution action of polishing liquids with the mechanical removal action of abrasive particles. This method, represented by CMP, is used for flattening processes in semiconductor manufacturing, but it originally applied technology for mirror finishing of silicon wafers. The manufacturing processes for semiconductor devices require extremely high precision, reaching atomic levels of 0.1 micrometers. There are various other polishing methods, but the chemical mechanical polishing provided by Nitta Haas is one of the most precise ultra-precision polishing techniques.
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IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

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Nanopure(TM)画像.jpg

Precision Grinding Slurry "Nanopure(TM)"

Polishing slurry that achieves nano-level surface quality.

The Nanopure(TM) series is a polishing slurry primarily used for primary polishing, secondary polishing, finishing polishing, and edge polishing of silicon wafers. The abrasive particles are made of high-purity colloidal silica, achieving excellent polishing performance through an optimal blend of additives. We will propose the most suitable product lineup based on your objectives and applications.

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Machplaner(TM)画像.jpg

Precision Grinding Slurry "Machplaner(TM)"

Polishing slurry that achieves a high polishing rate and good surface quality.

Through abrasive formulation technology and additive formulation technology based on colloidal silica, we achieve high polishing rates and high surface quality. We offer a lineup of products tailored to various polishing purposes and applications, including sapphire, glass, quartz, oxides, and resins. We will propose the optimal product lineup based on your objectives and applications.

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Related catalog(3)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

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Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

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Amada × Automation Subsidy: Search for Amada products eligible for subsidies now.

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The catalog subsidy is a grant system aimed at improving productivity and added value for small and medium-sized enterprises by selecting and implementing general-purpose labor-saving products such as IoT and robots from a pre-registered "product catalog." This initiative also aims to lead to wage increases. Features of the catalog subsidy: - Ability to choose general-purpose products from the catalog - Subsidy of up to 15 million yen - Support for applications from sales businesses - Ongoing public recruitment [Search for products that can be introduced with the catalog subsidy now] https://amada.shoryokuka-catalog.zeroplus-consul.co.jp/ *For more details, please refer to the related links or feel free to contact us.

Jan 10, 2026

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jan 09, 2026

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WiSAS 6th Anniversary Project Free Wi-Fi Environment Visualization Campaign

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Spline Network Co., Ltd. (Headquarters: Shibuya, Tokyo; President: Yoichi Yukino) will hold a free campaign for its WiSAS environmental scan service, one of its vulnerability assessment services, to commemorate the 6th anniversary of the release of the Wi-Fi Security Assurance Series (hereinafter referred to as WiSAS).

Jan 09, 2026

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"Comprehensive Review of DX Initiatives in 2025! Guide for Formulating DX Strategies for the Manufacturing Industry Towards 2026" Released

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The end of the year and the beginning of the new year is an excellent time to reflect on the past year and plan for the next. How did your company approach DX in 2025? Did you consider implementing a production management system? Did you take a step forward in utilizing AI? This article provides a practical guide to objectively evaluate your DX efforts in 2025 and to formulate specific strategies for 2026. Why not take the time during the year-end and New Year to carefully review your company's DX strategy? For more details, please see the related links.

Jan 09, 2026

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[Update] Regarding the discontinuation of basic authentication (SMTP AUTH) for Microsoft Exchange Online and the response of our products (EUC Automatic Email Option).

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Microsoft has announced that it will end support for Basic Authentication in Client Submission (SMTP Authentication) for Exchange Online between March and April 2026. Once this support is discontinued, sending emails using Basic Authentication (SMTP AUTH) will no longer be possible. Therefore, we would like to provide information regarding the affected features and planned responses in the TECHS series as follows. Reference: Microsoft Information Exchange Online to retire Basic auth for Client Submission (SMTP AUTH) Retirement of Basic Authentication for Exchange Online Please see the related links for more information.

Jan 09, 2026

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