[Basic Knowledge] Processing Process of Silicon Wafers and Polishing Examples

Silicon wafers are an important material that serves as the supporting substrate for semiconductor integrated circuits such as ICs and LSIs.
There is a polishing process in the manufacturing process. In this process, scratches and impurities formed on the wafer surface up to the previous step are removed, and the wafer is processed into a high-flatness wafer without distortion. Once finished in this process, the wafer achieves a completely distortion-free mirror-like surface.
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■ Silicon Wafer Polishing Case Study
Before CMP, the wafer is in the state where the rough polishing as "As Lapped" has been completed, with a surface roughness of Ra=1.57nm. Through multi-step CMP processing, the surface roughness is reduced to Ra=0.22nm.
- Achieving nano-level surface roughness and mirror finish
- Reduction of surface defects such as scratches and particles
- Improved yield


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This explains the overview of the manufacturing process of silicon wafers and the role of polishing in that process.