We will be exhibiting at NEPCON Japan "Semiconductor and Sensor Packaging Technology Exhibition."

We will be exhibiting at the NEPCON Japan "Semiconductor and Sensor Packaging Technology Exhibition" held at Tokyo Big Sight.
We sincerely apologize for the inconvenience during your busy schedule, but we kindly ask you to visit our booth.

Date and time | Wednesday, Jan 15, 2020 ~ Friday, Jan 17, 2020 10:00 AM ~ 06:00 PM (Only on the final day until 5 PM) |
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Capital | Dates: January 15 (Wednesday) to 17 (Friday), 2020 Venue: Tokyo Big Sight, West Exhibition Hall 1F Booth Number: W11-5 |
Entry fee | Free If you do not have an invitation ticket, the admission fee is 5,000 yen per person. |
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