We will be exhibiting at the 34th Internepcon Japan - Electronics Manufacturing and Assembly Exhibition - from January 15 to 17, 2020.

AXIS TECHNOLOGY Co., Ltd. will be exhibiting at the "34th Internepcon Japan - Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight.
Our booth will be jointly exhibited with Shimco Japan.
We plan to showcase the frame appearance inspection device "AXIS7000," the transport line "AXIS200," and the wafer simple inspection and handling inspection device "AXIS4500," among others.
We understand you are busy, but please invite relevant parties and be sure to stop by our booth.
[Exhibition Details]
■ Embossed tape internal and external inspection device "KIG2000A (standard) & KIG2000A-C2 (dual camera)"
■ Frame appearance inspection device (Wire & Chip) "AXIS7000"
■ Wafer simple inspection and handling inspection device "AXIS4500"
■ Transport line "AXIS200"

Date and time | Wednesday, Jan 15, 2020 ~ Friday, Jan 17, 2020 10:00 AM ~ 06:00 PM Only on the final day until 5 PM. |
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Capital | ■Venue: Tokyo Big Sight West Hall 1, West Exhibition Building 1F B Area ■Address: 3-11-1 Ariake, Koto-ku, Tokyo ■Access ・Approximately 7 minutes on foot from Rinkai Line "Kokusai Tenjijo Station" ・Approximately 3 minutes on foot from Yurikamome "Tokyo Big Sight Station" ■Booth Number: W8-12 (Joint exhibition with Simco Japan) |
Entry fee | Free Once your application is completed on the exhibition invitation ticket (free) application page, you will be able to download the exhibition invitation ticket (free). If you do not have an invitation ticket, the admission fee is 5,000 yen per person. |
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