It was published in the specialized magazine "Press Technology June issue."

This time, we will focus on stamping processes and explain a simple method for selecting materials suitable for stamping for designers.

Rational material selection enables the design of products that are easy to manufacture, leading to reduced costs due to fewer processes, improved productivity during mass production, and enhanced reliability and durability of the products. Designs with high forming difficulty will increase material and processing costs. Indicators of material properties for evaluating materials suitable for stamping include tensile strength, yield strength, elongation, hardness, Erichsen value, limiting drawing ratio, and conical cup value. However, two specific characteristic values that can directly evaluate formability are as follows: 1. The n-value representing work hardening characteristics 2. The r-value (Rankford value) representing anisotropy The n-value and r-value are characteristic values that directly relate to the quality of actual stamping processes, and this evaluation allows for the selection of appropriate materials. *For more details, please download the PDF or contact us.*

• Contract manufacturing

This document explains the key points of material selection.

In the process of spring design, once the stress level of the required material is determined, it is necessary to select a material that possesses those characteristics, and an understanding of the properties of the material is crucial. Table of Contents 1. Elements necessary for material selection 2. Mechanical property data by material 3. [For reference] Mechanical properties of stainless spring materials according to JIS standards *For more details, please download the PDF or contact us.

• Circuit board design and manufacturing

This is a collection of examples of drawing processes manufactured with progressive drawing dies using automatic press processing! Shall we solve your problems with drawing processes together?

A drawing die refers to a type of mold used in a processing method that creates various shapes of bottomed containers, such as cylinders, rectangular tubes, and cones, from a single thin sheet of metal. A characteristic feature of the formed products is that they have no seams. It is said to be the highest level of press processing. We would like to introduce a case study using our progressive die that has actually solved customer problems! Our products are primarily made using automatic press processing, ensuring stable quality, cost performance, and short delivery times, allowing us to meet customer demands. Please feel free to download it.

• fuse

As one of the challenges in new processing technologies, we are working on progressive deep drawing.

As one of the challenges in new processing technologies, we are working on progressive die stamping. This allows us to respond to the expansion of our customers' development designs by offering stamping processing for items that require strength, in addition to traditional curling techniques. We conduct consistent production from mold design with responsibility, maintaining top-level precision and longevity of our products. For more details, please contact us or refer to our catalog.

• Processing Contract

This is an introduction to a product with a narrowing from the tip to the neck, featuring an inner diameter of Φ0.7.

This is an introduction to a product with a taper from the tip to the neck, featuring an inner diameter of Φ0.7. The product has a thickness of 0.64, a height of 4.5, an inner diameter of φ0.7, and is made of brass, intended for use in LED-related components. Kyowa Hearts specializes in processing thin, small, and fine plate springs, from handmade prototypes to precision press processing using precision progressive molds. We are particularly skilled in the production of compact plate springs for mobile phones, computers, and connector parts. For more details, please contact us or refer to our catalog.

• Other machine elements

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)