[Announcement of Catalog Publication] Nakatani's New Technology

Sensor sealing is decided with this!
We have published a catalog introducing Nakatani's new technology.
By injecting low-melting-point thermoplastic resin into molds under low pressure and insert molding various electronic components, we can add diverse and excellent protective performance—this is a noteworthy new technology.
That is our "Hot Melt Molding."
The related catalog below introduces hot melt molding technology. Please download and take a look.

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