"Data on the adhesion strength of environmentally friendly water-based polyimide varnish" Adhesion between polyimide film and copper foil is possible using NMP completely free water-based polyimide varnish! Adhesion strength data and processing conditions are included!

Adhesion between polyimide film and copper foil is possible using NMP completely free water-based polyimide varnish! Adhesion strength data and processing conditions are included!

Our water-based polyimide varnish utilizes polyamic acid generated by regenerating unnecessary polyimide film during the processing of polyimide film through a unique chemical treatment, resulting in a "NMP completely free water-based polyimide varnish." This product can bond polyimide films and copper foils just like general-purpose polyimide varnishes. It is also applicable to uses that could not be processed due to the influence of "NMP" solvents. This document introduces adhesive strength and processing conditions. 【Representative Product】 NMP-free water-based polyimide varnish 【Features】 ■ Environmentally friendly water-based polyimide varnish ■ High heat resistance and chemical resistance ■ Can be stored at room temperature ■ Suitable viscosity for coating ■ Mixing proposals with other resins are possible ■ Improvement of working environment and global environmental improvement 【Applications】 ■ Wire coating varnish ■ Heat resistance enhancement for paints, conductive inks, and coatings ■ Sliding parts and materials requiring high-temperature resistance for automobiles/aircraft, etc. ■ Adhesives ■ Batteries ■ Heat-resistant paints ■ Prepreg products *For more details, please refer to the PDF document or feel free to contact us.

• Engineering Plastics

Completely NMP-free! A water-based polyimide varnish with excellent handling properties, high heat resistance, and chemical resistance, featuring low viscosity. Documentation is available, and free samples are being provided!

Polyimide varnish has characteristics of high heat resistance and chemical resistance, making it suitable for a wide range of fields and applications, including high-temperature sliding parts and related components for automobiles and aircraft, heat-resistant coatings, special adhesives, and wire insulation. It is a resin that will continue to be used by leveraging these features in the future. However, the current mainstream products are "NMP solution" or "a mixed solution of NMP and water." *NMP = N-methyl-2-pyrrolidone In recent years, "NMP" has raised concerns about its "toxicity," and it has been listed as a restricted substance under the "REACH regulations" in Europe, and it is expected to have an impact in Japan as well. NMP-free water-based polyimide varnish can contribute to "avoiding the use restrictions of NMP" and "reducing VOCs for environmental improvement." This product is expected to further enhance performance and reduce environmental impact in fields requiring high heat resistance and chemical resistance. It has excellent handling properties due to its stability at room temperature and low viscosity, comparable to general functional coatings. It is also believed to enable applications in processing methods that traditional polyimide varnishes could not be applied to. *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Ejectors tend to be avoided due to their enormous consumption of compressed air. However, they also have many advantages, such as noise reduction, no heat generation, and no vibrations. When used properly, they can also achieve energy savings. ■ Space-saving, noise reduction, and heat prevention! Goodbye, electric pumps Large ejectors are ideal for replacing electric pumps. Their impact is significant and greatly contributes to improving the environment in manufacturing sites. Moreover, maintenance can be done without tools. For more details, visit: https://www.ipros.jp/catalog/detail/718575

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately