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  1. Home
  2. Testing, Analysis and Measurement
  3. TA Instruments Japan (TAInstruments)
  4. December Online LIVE Seminar! ~High-Pressure Analysis Technology Seminar~
SEMINAR_EVENT
  • Nov 26, 2021
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Nov 26, 2021

December Online LIVE Seminar! ~High-Pressure Analysis Technology Seminar~

TA Instruments Japan TA Instruments Japan (TAInstruments)
**Title:** Evaluation of Metal Materials and Ceramics Using High-Temperature Analysis Technology TA Daisuke Yamamoto This presentation introduces the measurement principles, features, and evaluation examples of high-temperature analysis equipment handled by our company. The equipment includes flash method thermal diffusivity testing devices, thermal expansion measurement devices, and high-temperature viscometers. While a wide variety of materials can be evaluated, this time we will focus particularly on examples of metal materials and ceramics. From these devices, useful insights can be gained regarding resistance to temperature changes, dimensional changes, material composition, purity, structure, and optimization of manufacturing processes through firing. **Title:** Can Temperature Be Determined from Images? A Seminar on Welding Temperature Analysis Using High-Speed Cameras Shunsuke Hayashi, Nack Image Technology Co., Ltd. The high-speed camera visualizes phenomena occurring at incredible speeds. In fact, it not only allows for the observation of phenomena from recorded footage but also enables temperature analysis. Nack Image Technology Co., Ltd., which has been manufacturing and selling high-speed cameras for many years, will introduce the principles and methods of temperature analysis using high-speed cameras. ■ Examples of "visualization" using high-speed cameras in the welding field ■ Principles and methods of temperature analysis using high-speed cameras
Date and time Tuesday, Dec 21, 2021
01:00 PM ~ 02:00 PM
Capital
Entry fee Free
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Magnetic Levitation Gas Adsorption and Desorption Weight Analysis Device IsoSORP

Monitor the vapor adsorption and desorption behavior through weight change! Evaluation possible under high-pressure conditions up to 700 bar from vacuum.

This product adopts a patented "magnetic levitation balance" and allows for the evaluation of the vapor adsorption and desorption behavior of samples under various pressure conditions.

  • Other weight measuring instruments

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Optical Thermal Expansion Rate Measurement Device "DIL806"

Introducing the "DIL806," capable of measuring thermal expansion rates without contact. It is an ideal tool for measuring amorphous and soft samples.

The DIL 806 optical dilatometer is a high-performance thermal expansion and contraction measurement device provided by TA Instruments. By adopting optical measurement principles, this device enables non-contact measurements that were difficult with conventional dilatometers. The DIL 806 uses an absolute measurement process that is not affected by the expansion or contraction of the testing apparatus itself, eliminating the need to correct measurement results for different temperature programs. This device irradiates a wide planar light onto the sample using high-performance LEDs and detects the shadow of the sample with a high-resolution CCD sensor. A digital edge detection processor evaluates this signal, accurately and sensitively measuring the dimensional changes of the sample in response to temperature variations. The DIL 806 is ideal for measuring materials such as metals and plastics, and thin samples can be easily analyzed using a dedicated sample holder. The furnace allows for rapid heating up to 100°C/min and rapid cooling from 1400°C to 50°C in under 10 minutes. This enables efficient analysis of dynamic processes and tests that include multiple temperature steps.

  • Analytical Equipment and Devices

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Vertical Thermal Expansion Rate Measurement Device "DIL820 Series"

Measurement of thermal expansion in the vertical direction is possible! The highest sensitivity is guaranteed by a high-resolution inductive sensor (LVDT).

The DIL820 series (DIL 821/822) is a high-precision vertical dilatometer belonging to the DIL 820 series from TA Instruments. These models are equipped with a new optical encoder that has a resolution of 1nm, making them particularly suitable for the analysis of challenging samples. The DIL 822 employs true differential measurement technology, providing the best sensitivity and accuracy for CTE (coefficient of thermal expansion) in the market.

  • Analytical Equipment and Devices

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Dual Sample Thermal Expansion Rate Measurement Device 'DIL803/803L'

Introducing the "DIL802/802L," capable of high-precision dual sample measurement.

The DIL 803 is a dual-sample dilatometer that maximizes productivity by measuring two samples simultaneously. It can measure in vacuum or inert gas environments, while the DIL 803L is specialized for measurements in air. The horizontally arranged furnace ensures uniform temperature and eliminates the effects of air convection. A high-sensitivity LVDT is used to accurately measure even minute thermal expansion events.

  • Analytical Equipment and Devices

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Differential Thermal Expansion Rate Measurement Device 'DIL802/802L'

This is an introduction to the "DIL802/802L," which is skilled in dynamic temperature programs used for shrinkage rate control sintering (RCS) and measurements in low-temperature regions.

The DIL 802 is a device that achieves true differential measurement, providing the highest measurement accuracy. By measuring only the difference between the sample and the reference material, it eliminates the effects of system expansion. This design is particularly beneficial for dynamic temperature programs and measurements at low temperatures. The DIL 802 is suitable for measurements in vacuum or inert gas, while the DIL 802L is specialized for measurements in air. The horizontally arranged furnace ensures temperature uniformity and eliminates the effects of air convection. A high-sensitivity LVDT is used to accurately measure even minute thermal expansion events.

  • Analytical Equipment and Devices

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Single Sample Thermal Expansion Rate Measurement Device 'DIL801/801L'

Introducing the "DIL801," which allows measurements in air, vacuum, and inert gas purge, and the "DIL801L," which is ideal for evaluating the properties of ceramic materials.

The DIL 801 is an ideal device for measuring the thermal expansion of a single sample. It allows measurements in vacuum or inert gas environments, while the DIL 801L is specialized for measurements in air. This makes it suitable for evaluating the properties of ceramic materials. The horizontally arranged furnace ensures temperature uniformity and eliminates the effects of air convection. A high-sensitivity LVDT is used to accurately measure even minute thermal expansion events. Key features: - Measurement of linear dimensional changes over a wide temperature range - Capable of measurements in vacuum, inert gas, and air - Accurate displacement measurement with high-sensitivity LVDT - Ensures temperature uniformity with a horizontally arranged furnace - Compatible with various furnaces and easily interchangeable - Accurate temperature measurement with thermocouples or pyrometers - The measurement system can be composed of materials such as quartz glass, alumina, sapphire, graphite, and tungsten.

  • Analytical Equipment and Devices

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Quenching Dilatometer "DIL805" for Rapid Cooling Type Thermal Expansion Rate Measurement

Achieve high-precision measurements with the "DIL805 Series," capable of advanced characteristic evaluation and optimization!

The DIL 805 is a high-precision dilatometer provided by TA Instruments, specifically designed for detailed analysis of the thermal expansion properties of materials. This device is equipped with rapid heating and cooling capabilities, allowing it to simulate the thermal treatment processes of materials. The DIL 805 is an ideal tool for accurately measuring the coefficient of thermal expansion (CTE) of materials in research and development as well as quality control. 【Features】 ■ Advanced property evaluation and optimization in metal processing ■ Provides high-precision measurements ■ Real-time measurement of dimensional changes ■ Temperature range: 20°C to 1500°C

  • Analytical Equipment and Devices

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[Seminar] Initiatives for the Construction of Automated Logistics Roads

  • NEW
  • SEMINAR_EVENT

[Speaker] Ministry of Land, Infrastructure, Transport and Tourism, Road Bureau, Planning Division, Road Economic Research Office Planning Specialist Yuki Endo [Key Lecture Content] The Ministry of Land, Infrastructure, Transport and Tourism is advancing discussions on the realization of automated logistics roads as a new form of logistics in response to recommendations from the "Interim Summary on the State of High-Standard Road Networks," addressing logistics crises and carbon neutrality. This lecture will introduce the final summary on the state of automated logistics roads published in July of the 7th year of Reiwa, as well as the demonstration experiments planned for the 7th year of Reiwa. [Lecture Items] 1. Final summary on automated logistics roads 2. Demonstration experiments for the 7th year of Reiwa 3. Q&A / Business card exchange

Mar 18, 2026

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[Seminar] The Core of Connectivity Supporting SDV

  • NEW
  • SEMINAR_EVENT

[Speaker] NTT Docomo Business Inc. 5G & IoT Services Department Director in charge of Global Connected Cars, Yuji Tamai [Key Lecture Content] The value of SDV lies in continuously cycling 'updates × data × cloud', and connectivity is a prerequisite for this. In this presentation, we will organize the barriers of quality, cost, and regulation faced in global expansion, and explain the design principles and operational models from roaming enhancement, eSIM/RSP (SGP.32), integrated management (CMP), NTN, to Network API. Additionally, we will delve into security aspects related to connectivity, introducing phenomena observed in actual service operations and their countermeasures, as well as exploring other operational updates (staged delivery, avoiding simultaneous activation, monitoring/observability). [Lecture Items] 1. Positioning of connectivity in SDV 2. Barriers to global connectivity 3. Designing to "strengthen" roaming 4. eSIM/RSP and SGP.32 5. Integrated connectivity management (CMP) and operations 6. Further connectivity - NTN and Network API 7. Security and update operations 8. Q&A

Mar 18, 2026

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Graduating from a workplace that doesn't move unless you say so. How to change the field with a system.

  • NEW
  • SEMINAR_EVENT

"Even though I'm communicating, nothing changes." "When I give a warning, the atmosphere gets worse." — Are you trying to solve these problems just by changing how you interact? What you need is not to move people, but to create a workplace that is easy to navigate. I will explain based on numerous examples of on-site improvements that I have supported. Held on May 27 (Wednesday). Please check the LP for more details. ▼ For more information and registration (free), see below.

Mar 18, 2026

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Free Dry Fog Humidification System Demo Experience Event

  • NEW
  • SEMINAR_EVENT

At the Dry Fog Humidification System Free Demo Experience, you will have the opportunity to actually experience our Dry Fog, as well as our single-fluid and dual-fluid humidifiers. We will explain the differences from conventional humidifiers and the effects of implementation. In addition to introducing the latest case studies, we will also provide time for you to consult directly with our specialized staff. Please select a convenient venue and date from the application page and apply. * The "morning session" and "afternoon session" contain the same content. Please participate at a time that suits you. * This event is intended for users only. Participation from trading companies, other companies in the same industry, or for sales purposes to our company is not permitted. Venues: ■ Yamagata Venue: 3/12 (Wed) at Yamagata International Exchange Plaza 3/13 (Thu) at Sakata Chamber of Commerce and Industry ■ Sendai Venue: 3/14 (Fri) at Kiri no Ikeuchi Sendai Branch ■ Tokyo Venue & Osaka Venue: 3/18 (Tue), 3/19 (Wed), 3/21 (Fri) at Kiri no Ikeuchi Tokyo Sales Office & Kiri no Ikeuchi Osaka Headquarters ■ Nagoya Venue & Fukuoka Venue: 4/9 (Wed), 4/10 (Thu), 4/11 (Fri) at Kiri no Ikeuchi Nagoya Sales Office & Kiri no Ikeuchi Fukuoka Sales Office

Mar 18, 2026

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A Thorough Explanation of How to Proceed with AS/400 Rewrite through Q&A! - The Path to Project Success Revealed through On-Site Questions -

  • NEW
  • SEMINAR_EVENT

In recent years, as many companies are considering modernization, exploring methods for system renewal has become an important issue. This seminar will focus on "Rewrite," one of the solutions to such challenges, and will explain questions and issues encountered during project promotion in a Q&A format. <Program> - Opening - How to advance system renewal through "Rewrite" and key points for problem-solving - Introduction of unique tools to support migration <Recommended for> - Those who are struggling with specific methods for system renewal - Those who are concerned about the continuity of maintenance for existing systems and a shortage of personnel - Companies that own IBM i (AS/400) *We may refuse applications from competing companies or those not eligible to participate.

Mar 18, 2026

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