We are participating in the "Mizuho Phantom Factory."

Diffusion bonding for joining metals! There are also examples of its application in fuel cell separators with complex flow path patterns and filters for food manufacturing, which cannot be achieved through cutting processes!

Layered diffusion bonding is a method of joining layered materials by applying pressure and heat in a vacuum furnace. Due to the small deformation on the order of micrometers, it is suitable for machining parts with fine flow paths and complex shapes. ■ Application examples for fuel cell separators - Capable of accommodating complex flow path patterns that cannot be achieved through cutting processes - Stable quality due to the simultaneous bonding of multiple products - Complex part shapes can be created through layering - Strong against changes and deformation of parts as no adhesives are used - Simplification of the manufacturing line and reduction of time - Achieves flow paths without gaps at the bonding surfaces, resulting in no losses ■ Application examples for filters used in food manufacturing - Material: SUS316 - Dimensions: φ25×t1.5 - Layer composition: 50μm×30 layers - Mesh dimensions: φ75μm (inner) to φ100μm (outer) taper * For more details, please refer to the PDF document or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

Introducing a 4-axis hot press! Capable of processing workpieces up to the industry's largest size of 1000mm x 1000mm!

We would like to introduce the "corresponding sizes" in our diffusion bonding. Max 1000mm × 1000mm × 500mm (h), Minimum record φ0.9mm, □2mm cutout (line width 0.1mm), etc. Yamatec has introduced a 4-axis hot press to accommodate large sizes, enabling us to handle sizes that are difficult for other companies. Additionally, we are equipped with various special jigs for bonding processes involving extremely small and thin sizes, allowing for stable processing. 【Features】 ■ Introduction of a 4-axis hot press ■ Capable of processing one of the largest work sizes in the industry, Max 1000mm × 1000mm ■ Able to handle sizes that are difficult for other companies ■ Equipped with various special jigs of different shapes and sizes ■ Stable processing is possible *For more details, please refer to the PDF materials or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

High-cycle mold "Built-in cooling water channels for uniform cooling of the molding surface" produced using diffusion bonding technology!

Due to the limitations of conventional molds, it was impossible to arrange flow paths evenly on the molding surface, as only linear flow paths could be processed. By utilizing Yamatec's diffusion bonding technology, it becomes possible to process the mold in a sliced plate form. By stacking the components processed from each plate and performing diffusion bonding, it has become possible to design curved flow paths that are arranged evenly on the molding surface. 【Features】 ■ Uniform rapid cooling without product inconsistencies ■ Significant reduction in cooling time ■ Improved quality in product appearance, precision, strength, etc. ■ Increased production efficiency and reduced production costs *For more details, please refer to the PDF document or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

Yamatec has achieved numerous results with materials other than SUS, and titanium, nickel, aluminum, and stainless steel are also acceptable! Technical materials are also available!

At Yamatec, we have achieved numerous results and provide stable technology with materials other than SUS, which are said to be difficult by other companies. Starting with "stainless steel (SUS)", we also work with "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", and "titanium (Ti)". Additionally, we have many achievements in the joining of dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. 【Metals that can be joined at Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF materials or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

Method for manufacturing bottom bushes of direct blow molds or neck bushes of two-axis stretch blow molds! Joining technology that does not require welding or adhesion: [Diffusion Bonding].

We will introduce examples of production using diffusion bonding, including complex structure jigs, hollow heat sinks, and metal filtration filters. With diffusion bonding, it is possible to create molds with flow paths that could not be made using traditional mold manufacturing methods such as "cutting" or "casting." In particular, by incorporating precise flow paths within the mold that maximize cooling efficiency, production efficiency can be dramatically improved, resulting in a significant reduction in manufacturing costs. By stacking and bonding laminated materials, we can provide innovative molds that are more rational and have higher production efficiency without being constrained by manufacturing process limitations. 【Features】 ■ Creation of molds with cooling flow paths is possible using diffusion bonding ■ Significant reduction in manufacturing costs is achievable ■ Provision of more rational and highly efficient innovative molds ■ Capable of handling large sizes up to 1000 mm x 1000 mm *For more details, please refer to the PDF document or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

That concern might be solved with 【diffusion bonding (thermal pressing)】! Many successful examples! Fine channels within molds are also possible! Titanium, nickel, stainless steel, and more are acceptable!

A joining technology that does not require welding or adhesive, known as diffusion bonding (thermal pressing), is a method of joining various metals by heating and applying pressure without the use of adhesives (filler materials). It offers advantages such as enabling internal flow paths that are impossible with metal processing like cutting, and it produces almost no deformation, distortion, or burrs. "Could your concerns be resolved with diffusion bonding (thermal pressing)?" - I want to create complex jigs with no burrs at all. - Can you handle even small lot sizes? - I want to prototype and then mass-produce, but the delivery time is short. - I want to join aluminum alloys. - I have a rough design concept but want to develop it while verifying prototype data. - I want to place a consistent order for everything from material procurement to processing, joining, and inspection. - If the components of filler materials or insert metals have an impact, it can cause issues in the cleaning process. - I want to challenge further miniaturization of microchannel heat exchangers for hydrogen stations. *For more details, please refer to the PDF document or feel free to contact us.*

• Processing Contract

Realizing Precision Control in Energy Innovation Hydrogen, fuel cells, CCUS, biofuels, CNT manufacturing. There are technologies on-site that monitor precise flows to support the energy of the future. Brooks Instrument's flow meters support the energy transition.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 / Intel Core 3 Processor N355 ● DDR5 4800MHz SODIMM ×1 (supports up to 16GB) (sold separately) ● HDMI 1.4 ×1, eDP 1.4b / LVDS ×1 ● Intel Ethernet Controller I226 (2.5GbE RJ-45 ×1), Realtek RTL8111H (1GbE RJ-45 ×1) ● Full-size mSATA / mPCIe ×1, M.2 2230 E-Key ×1 ● USB 3.2 Gen2[x1] ×2, USB 2.0 ×4 ● RS-232/422/485 ×2, RS-232 ×2 ● TPM 2.0, SATA 6Gb/s ×1, 4-bit GPIO, SMBus / I2C ×1 ● Fan-equipped heat sink available separately PICO-ASL4-FAN01: Heat sink with fan PICO-ASL4-HSK01: Heat sink PICO-ASL4-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure) * This is a model without an operating system.