Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]
Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!
Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.
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【Other metals that can be joined with Yamatec】 ■ Other metals - HPM7, HPM38, STAVAX, S55C, SKD61, etc. ■ Dissimilar metals - Joining of three-layer dissimilar metals such as SUS/copper/SUS (certain conditions apply) 【Metals that can be joined with Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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![[Data] Tensile Strength Test Data (Conducted by Yamatech)](https://image.mono.ipros.com/public/catalog/image/01/050/536701/IPROS17171327969461740069.jpeg?w=120&h=170)
![[Production Example] Yamatec Co., Ltd. Diffusion Bonding](https://image.mono.ipros.com/public/catalog/image/01/0a7/536957/IPROS97088623254577328831.jpeg?w=120&h=170)
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Yamatec Co., Ltd. has been dedicated to diffusion bonding (thermal pressing) technology since its establishment in 1990, providing consistent delivery from prototype development to mass production with top-class technical skills, creativity, and support in the industry. Leading the next generation of cutting-edge diffusion bonding technology, Yamatec is a unique company specializing in metal bonding through diffusion bonding. The miniaturization, complexity, and efficiency of products are advancing rapidly. In this context, the necessity for diffusion bonding is increasing. Yamatec is constantly engaged in R&D, staying ahead of the times and striving for improvement every day.