We will be exhibiting at the "22nd Business Fair" on November 15, 2022.

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

Yamatec has achieved numerous results with materials other than SUS, and titanium, nickel, aluminum, and stainless steel are also acceptable! Technical materials are also available!

At Yamatec, we have achieved numerous results and provide stable technology with materials other than SUS, which are said to be difficult by other companies. Starting with "stainless steel (SUS)", we also work with "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", and "titanium (Ti)". Additionally, we have many achievements in the joining of dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. 【Metals that can be joined at Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF materials or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

Method for manufacturing bottom bushes of direct blow molds or neck bushes of two-axis stretch blow molds! Joining technology that does not require welding or adhesion: [Diffusion Bonding].

We will introduce examples of production using diffusion bonding, including complex structure jigs, hollow heat sinks, and metal filtration filters. With diffusion bonding, it is possible to create molds with flow paths that could not be made using traditional mold manufacturing methods such as "cutting" or "casting." In particular, by incorporating precise flow paths within the mold that maximize cooling efficiency, production efficiency can be dramatically improved, resulting in a significant reduction in manufacturing costs. By stacking and bonding laminated materials, we can provide innovative molds that are more rational and have higher production efficiency without being constrained by manufacturing process limitations. 【Features】 ■ Creation of molds with cooling flow paths is possible using diffusion bonding ■ Significant reduction in manufacturing costs is achievable ■ Provision of more rational and highly efficient innovative molds ■ Capable of handling large sizes up to 1000 mm x 1000 mm *For more details, please refer to the PDF document or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials