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  6. Introduction to Joining and Processing Technology: Dissimilar Metal Joining

Introduction to Joining and Processing Technology: Dissimilar Metal Joining

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last updated:Oct 06, 2022

ケニックス
ケニックス
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Applying the know-how cultivated in electron tube manufacturing technology! It is possible to join without oxidizing the metal!

Our bonding technology is characterized by the ability to join metals without oxidation in a reducing atmosphere, and this technology applies know-how cultivated in electronic tube manufacturing. In development examples, we have metallized ceramics to directly braze metal parts, producing components with excellent heat resistance, vacuum tightness, and insulation properties. Additionally, bonding between sapphire and metal is also possible, and we manufacture items such as viewing ports. 【Features】 ■ Environmental performance of the joint - Heat resistance temperature: -196℃ to 900℃ (varies with solder) - Leakage rate: 1×10^-9 Pa·m3/sec (He) ■ Main solders - Alloys of gold, silver, copper, and nickel (780℃ to 1083℃) *For more details, please refer to the PDF document or feel free to contact us.

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2022-10-04_15h50_18.png

Introduction to Joining and Processing Technology: Dissimilar Metal Joining

2022-10-04_15h50_18.png
2022-10-04_15h50_18.png
  • Related Link - http://www.kenix.jp/product/setugoukakou.html

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【Production Examples】 ■Joining of ceramic and metal ■Joining of sapphire and metal *For more details, please refer to the PDF document or feel free to contact us.

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[Applications] ■ Vacuum airtight components, research and development tools, analytical instrument parts *For more details, please refer to the PDF document or feel free to contact us.*

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ケニックス

ケニックス

Electronic Components and Semiconductors

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