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  6. Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]

Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]

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last updated:Jul 07, 2023

ヤマテック
ヤマテック
  • Official site

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

    Contract manufacturing
yamatekku.png

Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]

yamatekku.png
yamatekku.png
  • Related Link - https://www.yama-tech.com/kakusan3/

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basic information

【Other metals that can be joined with Yamatec】 ■ Other metals - HPM7, HPM38, STAVAX, S55C, SKD61, etc. ■ Dissimilar metals - Joining of three-layer dissimilar metals such as SUS/copper/SUS (certain conditions apply) 【Metals that can be joined with Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF document or feel free to contact us.

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catalog(4)

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Yamatec Co., Ltd. "Diffusion Bonding Technology Comprehensive Catalog"

Yamatec Co., Ltd. "Diffusion Bonding Technology Comprehensive Catalog"

CATALOG
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[Data] Tensile Strength Test Data (Conducted by Yamatech)

[Data] Tensile Strength Test Data (Conducted by Yamatech)

OTHER
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[Production Example] Yamatec Co., Ltd. Diffusion Bonding

[Production Example] Yamatec Co., Ltd. Diffusion Bonding

TECHNICAL
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Sprue bush realized through high-cycle molding of diffusion bonding.

Sprue bush realized through high-cycle molding of diffusion bonding.

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News about this product(7)

We will be exhibiting at the Tokyo Business Opportunity EXPO from December 14 to 15, 2022.

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Yamatech Co., Ltd. will exhibit at the "Tokyo Business Opportunity EXPO" held at Tokyo Big Sight from December 14 to 15, 2022. This time, we will be showcasing products such as joints of similar metals and dissimilar metals at booth <C-31>. Please feel free to stop by our booth. We look forward to seeing you.

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We will be exhibiting at the "22nd Business Fair" on November 15, 2022.

  • Seminar・Event

Yamatech Co., Ltd. will be exhibiting at the "22nd Business Fair" to be held on November 15, 2022, at Shibuya Hikarie, Hikarie Hall. There will be a variety of content including exhibitor booths from over 160 companies and organizations, an SDGs corner, and seminars. Please feel free to stop by our booth (E16). We look forward to seeing you. *The attached image is reprinted from the website.

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We will exhibit at the "New Technology Creation Exchange Meeting 2022" on October 26 and 27, 2022.

  • Seminar・Event

Yamatec Co., Ltd. will be exhibiting at the "New Technology Creation Exchange 2022" to be held on October 26 and 27, 2022, at the Tokyo Tama Future Messe. This time, we will showcase mold samples with internal flow paths, as well as bonded products made of the same and different types of metals, at our booth (K-70). Please feel free to stop by our booth. We look forward to seeing you. *The attached image is reprinted from the website.

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We will be exhibiting at the "Mold Exhibition Nagoya" from July 6 to 9, 2022.

  • Seminar・Event

Yamatech Co., Ltd. will be exhibiting at the "Mold Exhibition Nagoya" held at Port Messe Nagoya from July 6 to 9, 2022. This time, we will showcase mold samples featuring internal flow paths, as well as bonded products of the same and different metals, at our booth (3-404). Please feel free to stop by our booth. We look forward to seeing you.

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Companynews list (8)

Company information

ヤマテック

ヤマテック

Manufacturing and processing contract

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Yamatec Co., Ltd. has been dedicated to diffusion bonding (thermal pressing) technology since its establishment in 1990, providing consistent delivery from prototype development to mass production with top-class technical skills, creativity, and support in the industry. Leading the next generation of cutting-edge diffusion bonding technology, Yamatec is a unique company specializing in metal bonding through diffusion bonding. The miniaturization, complexity, and efficiency of products are advancing rapidly. In this context, the necessity for diffusion bonding is increasing. Yamatec is constantly engaged in R&D, staying ahead of the times and striving for improvement every day.

Product/Service List (14)

Related Products from ヤマテック

Yamatec Co., Ltd. "Diffusion Bonding Comprehensive Catalog"
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Yamatec Co., Ltd. "Diffusion Bonding Comprehensive Catalog"
Diffusion bonding (thermal pressing) *Free comprehensive technical catalog available!
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Titanium, nickel, aluminum, and stainless steel are also acceptable [diffusion bonding (thermal pressing)].
Manufacturing and processing machinery
Titanium, nickel, aluminum, and stainless steel are also acceptable [diffusion bonding (thermal pressing)].

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