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  3. ヤマテック
  4. We will be exhibiting at the "Mold Exhibition Nagoya" from July 6 to 9, 2022.
SEMINAR_EVENT
  • Jun 28, 2022
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Jun 28, 2022

We will be exhibiting at the "Mold Exhibition Nagoya" from July 6 to 9, 2022.

ヤマテック ヤマテック
Yamatech Co., Ltd. will be exhibiting at the "Mold Exhibition Nagoya" held at Port Messe Nagoya from July 6 to 9, 2022. This time, we will showcase mold samples featuring internal flow paths, as well as bonded products of the same and different metals, at our booth (3-404). Please feel free to stop by our booth. We look forward to seeing you.
Date and time Wednesday, Jul 06, 2022 ~ Saturday, Jul 09, 2022
10:00 AM ~ 05:00 PM
Ends at 16:00 only on the final day.
Capital ■Venue: Port Messe Nagoya ■Address: 2-2 Kinjo-futo, Minato Ward, Nagoya City, Aichi Prefecture ■Access  ・Get off at "Kinjo-futo" Station on the Aonami Line, about a 5-minute walk  ・Exit at Meiko Chuo IC ■Booth Number: 3-404 ■<Venue Layout Diagram> https://ma.imsys.jp/r/1508492?m=0000&c=00000000 ■Admission Ticket Pre-registration is required for entry. (Admission is free!) After pre-registering, you will receive an email with your ID and password to access your My Page. Please print out your visitor badge from My Page and bring it with you to the venue on the day of the event. Registration is available at the following site: https://ma.imsys.jp/r/1508493?m=0000&c=00000000
Entry fee Free One admission ticket is required per person for entry. If you do not have an invitation ticket, the admission fee is 5,000 yen per person.
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Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

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Titanium, nickel, aluminum, and stainless steel are also acceptable [diffusion bonding (thermal pressing)].

Yamatec has achieved numerous results with materials other than SUS, and titanium, nickel, aluminum, and stainless steel are also acceptable! Technical materials are also available!

At Yamatec, we have achieved numerous results and provide stable technology with materials other than SUS, which are said to be difficult by other companies. Starting with "stainless steel (SUS)", we also work with "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", and "titanium (Ti)". Additionally, we have many achievements in the joining of dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. 【Metals that can be joined at Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF materials or feel free to contact us.

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Examples of production: complex structure jigs, hollow heat sinks, metal filtration filters.

Method for manufacturing bottom bushes of direct blow molds or neck bushes of two-axis stretch blow molds! Joining technology that does not require welding or adhesion: [Diffusion Bonding].

We will introduce examples of production using diffusion bonding, including complex structure jigs, hollow heat sinks, and metal filtration filters. With diffusion bonding, it is possible to create molds with flow paths that could not be made using traditional mold manufacturing methods such as "cutting" or "casting." In particular, by incorporating precise flow paths within the mold that maximize cooling efficiency, production efficiency can be dramatically improved, resulting in a significant reduction in manufacturing costs. By stacking and bonding laminated materials, we can provide innovative molds that are more rational and have higher production efficiency without being constrained by manufacturing process limitations. 【Features】 ■ Creation of molds with cooling flow paths is possible using diffusion bonding ■ Significant reduction in manufacturing costs is achievable ■ Provision of more rational and highly efficient innovative molds ■ Capable of handling large sizes up to 1000 mm x 1000 mm *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(1)

Yamatec Co., Ltd. "Diffusion Bonding Technology Comprehensive Catalog"

Yamatec Co., Ltd. "Diffusion Bonding Technology Comprehensive Catalog"

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Notice of Participation in the "PV EXPO International Photovoltaic Exhibition" from November 18 (Wednesday) to November 20 (Friday), 2026.

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Chuo Automobile Industry Co., Ltd. will be exhibiting at the "PV EXPO International Photovoltaic Power Generation Exhibition" held at Intex Osaka. A variety of products and technologies will be showcased, ranging from advanced solar cells to the construction, maintenance, and operation of solar power plants, with experts from around the world attending the exhibition. This event, where people and information gather "in real life" from all over the world, is an important platform to accelerate the solar power business through face-to-face interactions. We sincerely look forward to your visit.

Oct 27, 2026

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EdggeTech+ 2025

Notice of Participation in EdgeTech+ 2025

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Rineo Solutions will be exhibiting at EdgeTech+ 2025. At the venue, we will introduce the total solutions from the Cybertrust Group that can be widely used from the design to the operational phase of embedded Linux development. We invite you to visit the Cybertrust/Rineo Solutions booth during your visit. ■ Products Scheduled for Display SBOM and Vulnerability Management "Timesys Vigiles" Embedded Linux Ultra-Fast Boot Solution "LINEOWarp!!" "Embedded Linux Maintenance Service" Long-Term Usable IoT and Embedded Linux OS "EMLinux" SBOM-Compatible Vulnerability Management Tool "Miracle Vul Hammer" ■ Announcement of Presentations At this exhibition, there will be two presentations by members of Cybertrust/Rineo Solutions. We plan to introduce useful information for the development and operation of embedded Linux products, so please join us.

Oct 26, 2026

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JIMTOF2026 is being held today!

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The JIMTOF2026 has started today, October 26! When you visit, please be sure to stop by our booth. (Booth number: East 1 E1014) ▼JIMTOF2026 Special Page https://www.somax.co.jp/notice02/ We sincerely look forward to your visit!

Oct 26, 2026

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We will exhibit at the Suwa Industrial Messe 2026, Makome Laboratory.

  • NEW
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● Dates: November 12 (Thursday) to November 14 (Saturday), 2026 10:00 AM to 4:00 PM (Final day, the 14th, until 3:00 PM) ● Venue: Okaya City Comprehensive Gymnasium ● Exhibition Name: Suwa Area Industrial Messe 2026 ● Our Booth: East 156 ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Sales and technical staff will be on-site, so we welcome consultations on matters beyond the exhibited products. Feel free to stop by. We look forward to your visit.

Oct 26, 2026

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Exhibition at BREX Kansai

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We are pleased to announce that Gywood has been recommended as a featured building material in the special project "Recommended Building Materials" at the Housing Business Fair within the comprehensive exhibition [BREX Kansai] for housing, architecture, and real estate. We will be exhibiting in the "Recommended Building Materials and Equipment" zone, where professionals from the field gather to showcase their recommended materials. We invite everyone to stop by and visit us.

Oct 26, 2026

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