【High Scalability & High Maintainability】Compact Sputtering Device HEX-Fission【Ideal for R&D!】

A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

The HEX system features a unique "modular structure." By exchanging the panels that make up each face of the hexagonal prism-shaped chamber, you can freely change the number and arrangement of ports. As a result, you can easily modify the configuration and expand functionality, much like assembling blocks, in response to changes in research direction. The HEX system is a compact and highly expandable vacuum deposition device that fills the gap between benchtop systems and UHV systems, based on a new concept. ◆ The "modular structure" allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Supports simultaneous film formation from multiple sources ◆ Compatible with sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes (for lithium-ion batteries, etc.) For more details, please refer to the catalog available for download as a PDF. If you have any questions, please feel free to contact us.

• Sputtering Equipment

Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

This is a sputtering source for the multi-purpose vacuum deposition device HEX/HEX-L. It can be used in DC mode when the target is a conductor and in RF mode when the target is an insulator. With a gas hood as standard equipment, it is possible to increase the pressure near the target surface while keeping the chamber pressure low during film formation. Quick-release connectors are used for the connections of cooling water piping and gas piping, allowing for easy installation and removal of the piping without the need for tools. The Fission source can be fixed to the chamber with four butterfly nuts, eliminating the need for tools during installation and removal. It also supports reactive sputtering, enabling the deposition of oxides and nitrides. Up to three deposition sources can be installed on the HEX and up to six on the HEX-L, allowing for the deposition of multilayer films and compound films.

• Sputtering Equipment

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

This is a resistance heating evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The resistance heating evaporation method is the most common vacuum deposition process. Materials are placed in a boat-type or crucible-type heating container, and by passing current through the heating container, resistance heat is generated to heat the materials. Once the temperature of the heating container rises sufficiently, the materials inside begin to evaporate. The deposition rate can be controlled by the current. The advantage of the resistance heating evaporation device is that it does not use process gases. Therefore, it operates at high vacuum levels, resulting in deposited films containing very few impurities. The TES source is fixed to the chamber with four butterfly nuts. Additionally, the cooling water piping is connected via quick-release connectors, allowing for quick replenishment of materials or replacement of boats/filaments. Up to five TES sources can be installed on the HEX, and up to six on the HEX-L. They can also be used in combination with the sputter source Fission, the electron beam evaporation source TAU, and the organic evaporation source ORCA.

• Sputtering Equipment

Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.

This is an electron beam evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The TAU series is a "mini" electron beam evaporation source. By using TAU, the HEX system can be utilized as an electron beam evaporation device (EB evaporation device). The material is heated by applying high voltage to it and accelerating thermal electrons emitted from a filament located right next to it to collide with the material. Unlike large electron beam evaporation sources, it does not use electron beam deflection magnets. Each pocket of the TAU source is equipped with a "flux monitoring plate" as standard, which detects the slight ions contained in the vapor. The ion current value detected here is proportional to the deposition rate and is sensitive enough to precisely grow sub-monolayer films. The TAU-4, which is a simultaneous deposition model with four sources, has independent flux monitoring plates in each of the four pockets, allowing for monitoring of the deposition rate in each pocket during simultaneous deposition. The TAU source can deposit from either a rod or a crucible, depending on the material. We can suggest the optimal deposition method, so please feel free to contact us.

• Sputtering Equipment

Organic deposition source for the multipurpose vacuum deposition device HEX system.

This is an organic deposition source for the multi-purpose vacuum deposition device HEX/HEX-L. By installing ORCA, the HEX system can be used as an organic material deposition device. The ORCA source actively cools the crucible. The balance between heating and cooling achieves excellent temperature stability and control. The crucible is made of a material with high thermal conductivity, preventing the occurrence of hotspots that could adversely affect the deposition rate. Alumina and graphite liners are also available. The temperature of the crucible is measured by a K-type thermocouple, allowing for more accurate temperature measurements than conventional contact thermocouples. ORCA comes with a power supply unit and a PID controller optimized for low-temperature operation. The ORCA source can be used in combination with sputter sources, electron beam deposition sources, and resistance heating deposition sources. The area around the crucible is covered with a cooled protective cap, minimizing thermal interference from adjacent sources.

• Sputtering Equipment

Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

This is a sample stage for the multi-purpose vacuum deposition device HEX/HEX-L. Choosing the correct sample stage is as important as selecting the right film formation method. The characteristics of the sample stage affect uniformity, morphology, and film composition. It accommodates samples with a maximum diameter of 4 inches for HEX and 6 inches for HEX-L. In addition to the standard fixed sample stage, rotating, rotating heated, and rotating water-cooled sample stages are available.

• Sputtering Equipment

The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four ways: left, center, right, with 4 spots and 12 spots settings. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor modes with a single model. 【Recommended for such places!】 ☑ Entrances facing busy corridors ☑ Counters or signs near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

Japan is among the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of significant earthquakes occurring. For the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake measures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" ◎ For more details, please download the materials or contact us.

The particle visualization technology developed under our brand "ViEST" has a very high level of detection sensitivity that allows for real-time visualization of the suspended and adhered states of micro and nano-sized particles. We are expanding our sales of visualization systems and contract services for evaluation (investigating particles and airflow in production processes, inside and outside manufacturing equipment, evaluating the performance of cleaning products, proposing yield improvement measures, etc.) both domestically and internationally. At this exhibition, we will demonstrate our particle visualization system along with three new products that were just released last year. Please experience the excitement of high particle detection performance and visualization at the venue. 【Date】 September 17 (Wed) - September 19 (Fri), 2025 【Time】 10:00 AM - 5:00 PM 【Venue】 Makuhari Messe, Hall 6 E20-21 Free entry. Pre-registration for attendance is required on the organizer's website. https://www.wsew.jp/autumn/ja-jp.html#/

In response to the rapid advancement of chiplet integration*¹ and finer wiring in semiconductor package substrates—driven by the explosive growth of the AI market—we are pleased to announce the launch of our next-generation semiconductor package substrate AOI system, the “SX7000” series, and our “LX7000” laser repair system. Orders are now being accepted. *1 A technology that divides what was traditionally integrated on a single large silicon die into multiple smaller chips, each responsible for a specific function, and connects them at high speed within a single package. This approach is increasingly being adopted in high-performance processors for AI applications. ■Line/Space SX7400：1.5μm/1.5μm～ SX7300：2μm/2μm～ LX7000：2μm/2μm～ ■Target product size SX7400：615mm × 515mm SX7300：615mm × 515mm LX7000：615mm × 515mm

The "HM-S6" is an embedded park sensor that detects vehicles through changes in magnetic flux and can respond to various situations from passing to stationary. It can be used for the opening and closing of the input doors at waste treatment plants, as well as for gates where vehicles pass and in outdoor parking applications. It can also be installed on rebar and steel plates. 【Features】 - Resistant to the effects of natural environments such as rain, snow, temperature changes, and geomagnetism. - Protection rating IP68 reduces the risk of water ingress. - Ten times the load capacity compared to conventional embedded park sensors (according to our comparison). - Can distinguish between vehicles even when they pass continuously, one by one. - Can be installed on rebar and steel plates. *For more details, please refer to the PDF document or feel free to contact us.