【High Scalability & High Maintainability】Compact Resistance Heating Vapor Deposition Device HEX-TES【Perfect for R&D!】

A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

The HEX system features a unique "modular structure." By exchanging the panels that make up each face of the hexagonal prism-shaped chamber, you can freely change the number and arrangement of ports. As a result, you can easily modify the configuration and expand functionality, much like assembling blocks, in response to changes in research direction. The HEX system is a compact and highly expandable vacuum deposition device that fills the gap between benchtop systems and UHV systems, based on a new concept. ◆ The "modular structure" allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Supports simultaneous film formation from multiple sources ◆ Compatible with sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes (for lithium-ion batteries, etc.) For more details, please refer to the catalog available for download as a PDF. If you have any questions, please feel free to contact us.

• Sputtering Equipment

Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

This is a sputtering source for the multi-purpose vacuum deposition device HEX/HEX-L. It can be used in DC mode when the target is a conductor and in RF mode when the target is an insulator. With a gas hood as standard equipment, it is possible to increase the pressure near the target surface while keeping the chamber pressure low during film formation. Quick-release connectors are used for the connections of cooling water piping and gas piping, allowing for easy installation and removal of the piping without the need for tools. The Fission source can be fixed to the chamber with four butterfly nuts, eliminating the need for tools during installation and removal. It also supports reactive sputtering, enabling the deposition of oxides and nitrides. Up to three deposition sources can be installed on the HEX and up to six on the HEX-L, allowing for the deposition of multilayer films and compound films.

• Sputtering Equipment

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

This is a resistance heating evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The resistance heating evaporation method is the most common vacuum deposition process. Materials are placed in a boat-type or crucible-type heating container, and by passing current through the heating container, resistance heat is generated to heat the materials. Once the temperature of the heating container rises sufficiently, the materials inside begin to evaporate. The deposition rate can be controlled by the current. The advantage of the resistance heating evaporation device is that it does not use process gases. Therefore, it operates at high vacuum levels, resulting in deposited films containing very few impurities. The TES source is fixed to the chamber with four butterfly nuts. Additionally, the cooling water piping is connected via quick-release connectors, allowing for quick replenishment of materials or replacement of boats/filaments. Up to five TES sources can be installed on the HEX, and up to six on the HEX-L. They can also be used in combination with the sputter source Fission, the electron beam evaporation source TAU, and the organic evaporation source ORCA.

• Sputtering Equipment

Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.

This is an electron beam evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The TAU series is a "mini" electron beam evaporation source. By using TAU, the HEX system can be utilized as an electron beam evaporation device (EB evaporation device). The material is heated by applying high voltage to it and accelerating thermal electrons emitted from a filament located right next to it to collide with the material. Unlike large electron beam evaporation sources, it does not use electron beam deflection magnets. Each pocket of the TAU source is equipped with a "flux monitoring plate" as standard, which detects the slight ions contained in the vapor. The ion current value detected here is proportional to the deposition rate and is sensitive enough to precisely grow sub-monolayer films. The TAU-4, which is a simultaneous deposition model with four sources, has independent flux monitoring plates in each of the four pockets, allowing for monitoring of the deposition rate in each pocket during simultaneous deposition. The TAU source can deposit from either a rod or a crucible, depending on the material. We can suggest the optimal deposition method, so please feel free to contact us.

• Sputtering Equipment

Organic deposition source for the multipurpose vacuum deposition device HEX system.

This is an organic deposition source for the multi-purpose vacuum deposition device HEX/HEX-L. By installing ORCA, the HEX system can be used as an organic material deposition device. The ORCA source actively cools the crucible. The balance between heating and cooling achieves excellent temperature stability and control. The crucible is made of a material with high thermal conductivity, preventing the occurrence of hotspots that could adversely affect the deposition rate. Alumina and graphite liners are also available. The temperature of the crucible is measured by a K-type thermocouple, allowing for more accurate temperature measurements than conventional contact thermocouples. ORCA comes with a power supply unit and a PID controller optimized for low-temperature operation. The ORCA source can be used in combination with sputter sources, electron beam deposition sources, and resistance heating deposition sources. The area around the crucible is covered with a cooled protective cap, minimizing thermal interference from adjacent sources.

• Sputtering Equipment

Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

This is a sample stage for the multi-purpose vacuum deposition device HEX/HEX-L. Choosing the correct sample stage is as important as selecting the right film formation method. The characteristics of the sample stage affect uniformity, morphology, and film composition. It accommodates samples with a maximum diameter of 4 inches for HEX and 6 inches for HEX-L. In addition to the standard fixed sample stage, rotating, rotating heated, and rotating water-cooled sample stages are available.

• Sputtering Equipment

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.