Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

The HEX system features a unique "modular structure." By exchanging the panels that make up each face of the hexagonal prism-shaped chamber, you can freely change the number and arrangement of ports. As a result, you can easily modify the configuration and expand functionality, much like assembling blocks, in response to changes in research direction. The HEX system is a compact and highly expandable vacuum deposition device that fills the gap between benchtop systems and UHV systems, based on a new concept. ◆ The "modular structure" allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Supports simultaneous film formation from multiple sources ◆ Compatible with sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes (for lithium-ion batteries, etc.) For more details, please refer to the catalog available for download as a PDF. If you have any questions, please feel free to contact us.

• Sputtering Equipment

Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

This is a sputtering source for the multi-purpose vacuum deposition device HEX/HEX-L. It can be used in DC mode when the target is a conductor and in RF mode when the target is an insulator. With a gas hood as standard equipment, it is possible to increase the pressure near the target surface while keeping the chamber pressure low during film formation. Quick-release connectors are used for the connections of cooling water piping and gas piping, allowing for easy installation and removal of the piping without the need for tools. The Fission source can be fixed to the chamber with four butterfly nuts, eliminating the need for tools during installation and removal. It also supports reactive sputtering, enabling the deposition of oxides and nitrides. Up to three deposition sources can be installed on the HEX and up to six on the HEX-L, allowing for the deposition of multilayer films and compound films.

• Sputtering Equipment

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

This is a resistance heating evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The resistance heating evaporation method is the most common vacuum deposition process. Materials are placed in a boat-type or crucible-type heating container, and by passing current through the heating container, resistance heat is generated to heat the materials. Once the temperature of the heating container rises sufficiently, the materials inside begin to evaporate. The deposition rate can be controlled by the current. The advantage of the resistance heating evaporation device is that it does not use process gases. Therefore, it operates at high vacuum levels, resulting in deposited films containing very few impurities. The TES source is fixed to the chamber with four butterfly nuts. Additionally, the cooling water piping is connected via quick-release connectors, allowing for quick replenishment of materials or replacement of boats/filaments. Up to five TES sources can be installed on the HEX, and up to six on the HEX-L. They can also be used in combination with the sputter source Fission, the electron beam evaporation source TAU, and the organic evaporation source ORCA.

• Sputtering Equipment

Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.

This is an electron beam evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The TAU series is a "mini" electron beam evaporation source. By using TAU, the HEX system can be utilized as an electron beam evaporation device (EB evaporation device). The material is heated by applying high voltage to it and accelerating thermal electrons emitted from a filament located right next to it to collide with the material. Unlike large electron beam evaporation sources, it does not use electron beam deflection magnets. Each pocket of the TAU source is equipped with a "flux monitoring plate" as standard, which detects the slight ions contained in the vapor. The ion current value detected here is proportional to the deposition rate and is sensitive enough to precisely grow sub-monolayer films. The TAU-4, which is a simultaneous deposition model with four sources, has independent flux monitoring plates in each of the four pockets, allowing for monitoring of the deposition rate in each pocket during simultaneous deposition. The TAU source can deposit from either a rod or a crucible, depending on the material. We can suggest the optimal deposition method, so please feel free to contact us.

• Sputtering Equipment

Organic deposition source for the multipurpose vacuum deposition device HEX system.

This is an organic deposition source for the multi-purpose vacuum deposition device HEX/HEX-L. By installing ORCA, the HEX system can be used as an organic material deposition device. The ORCA source actively cools the crucible. The balance between heating and cooling achieves excellent temperature stability and control. The crucible is made of a material with high thermal conductivity, preventing the occurrence of hotspots that could adversely affect the deposition rate. Alumina and graphite liners are also available. The temperature of the crucible is measured by a K-type thermocouple, allowing for more accurate temperature measurements than conventional contact thermocouples. ORCA comes with a power supply unit and a PID controller optimized for low-temperature operation. The ORCA source can be used in combination with sputter sources, electron beam deposition sources, and resistance heating deposition sources. The area around the crucible is covered with a cooled protective cap, minimizing thermal interference from adjacent sources.

• Sputtering Equipment

Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

This is a sample stage for the multi-purpose vacuum deposition device HEX/HEX-L. Choosing the correct sample stage is as important as selecting the right film formation method. The characteristics of the sample stage affect uniformity, morphology, and film composition. It accommodates samples with a maximum diameter of 4 inches for HEX and 6 inches for HEX-L. In addition to the standard fixed sample stage, rotating, rotating heated, and rotating water-cooled sample stages are available.

• Sputtering Equipment

"ROBO TUBE" is a microtube with 1D/2D code that achieves excellent sealing and fitting properties. By integrating polypropylene and thermoplastic elastomer through one-shot molding, it realizes superior sealing and fitting. Compared to conventional microtubes, the opening and closing of the cap is very smooth, reducing the stress of cap operation. 【Features】 ■ The opening and closing of the cap is very smooth compared to conventional microtubes ■ Reduces the stress of cap operation ■ Innovative two-color molding of polypropylene and thermoplastic elastomer ■ Achieves excellent sealing and fitting properties ■ High compatibility with lab automation *For more details, please download the PDF or feel free to contact us.

We have unveiled two new products. 【Downflow Dust Collector (DFPRE Large Series)】 A packaged dust collector that combines productivity and practicality. It uses downward airflow to reduce filter load, leading to lower maintenance costs. Suitable for various industrial sectors including metal and machining, industrial applications, and waste recycling. 【Workstation Dust Collector (DBE Series)】 A dust collector integrated with a workstation, saving space. Recommended for dust control in manufacturing processes such as grinding, polishing, cutting, and finishing. It accommodates long and heavy workpieces. Applicable in various manufacturing processes including metalworking, aircraft parts manufacturing, automotive manufacturing, and industrial machinery manufacturing. For more details, please refer to the downloadable catalog or contact us. (C) Nippon Donaldson, Ltd. All rights reserved.

● To determine the sealing and waterproofing of sealed products based on pressure changes, it is not necessary to conduct tests that involve spraying water on the product or immersing it in water. ● Once the product is placed in a dedicated fixture within the inspection device, waterproofing can be quantitatively confirmed through automatic measurement. ● The target product size is W 300 × D 210 × H 100 mm or smaller. ● The target products include automotive cameras, smartphones, ECUs, small motors, and other packaging containers, and are effective for any products that require confirmation of sealing, waterproofing, and airtightness. ● For product specifications and details, please contact us.

In battery manufacturing lines, if components containing copper are used, there is a possibility that metal powder may mix in, dissolve, ionize, and pass through the separator, causing a malfunction that connects the positive and negative electrodes. Such minute metal powders may not be detected during pre-shipment inspections, and even if they are found, they can lead to various issues, such as the need to increase inspection processes to detect them. Therefore, Fukuda has developed a copper-free (all stainless steel) air leak tester that can be safely used in the production lines of battery manufacturers and secondary battery manufacturing equipment manufacturers. For product specifications and details, please refer to the "Related Product Information" and "Related Catalogs" below.

Introducing a "non-destructive testing device as an alternative to the submerged test" for pharmaceutical packaging products. "Complete vial leak testing device | MSQ-2002 series" Fully automating leak tests for various vials, bottles, eye drops, and cylindrical containers. Please check the link below for videos and catalogs.