Vecow will be exhibiting at "Japan IT Week Nagoya 2022" held in Nagoya, Japan.

Equipped with a neural processing unit (NPU) and adopting the power-efficient Cortex-A53, it meets the needs of all embedded applications.

The EIC-2000, equipped with an industrial-grade Arm-based NXP i.MX 8M Plus quad-core Cortex-A53 processor and built-in NPU supporting up to 2.3 TOPS, features GigE LAN ports compliant with Intel Time-Sensitive Networking (TSN) standards, enabling seamless access. Additionally, it offers a rich set of expansion options including two USB 3.0 ports, one Micro USB port, two Nano SIM card sockets, and a Mini PCIe socket, making it an ideal AI edge computing system for applications such as base station construction, irrigation systems, and factory automation in AIoT/Industry 4.0. *Please download the catalog or visit our website to check the main specifications.*

• Image Processing Equipment
• Embedded Board Computers
• Other embedded systems (software and hardware)

The ECX-3000 series is a fanless industrial PC that supports a wide range of 9V-50VDC input and 5G/10GbE specifications, making it ideal for harsh environments.

Equipped with 14th/13th/12th generation Intel Core i9/i7/i5/i3 processors (14th generation, RPL-S Refresh/RPL-S/ADL-S) and featuring the Intel R680E chipset, this fanless model boasts a highly reliable ultimate mechanical design that supports a wide operating temperature range of -40°C to 75°C. It offers 80V surge protection and supports a wide power input range of 9 to 50V, with options for a rich selection of Ethernet (10G LAN/2.5G LAN/GigE LAN). Additionally, it is equipped with a SIM socket for convenient external access and supports easy front access to four M.2 SSDs. The high-performance fanless PC "ECX-3000 Series," which supports 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS, is an ideal choice for various edge AI applications, including machine vision, in-vehicle computing, public safety, automated factories, intelligent transportation systems (ITS), autonomous mobile robots (AMR), automated guided vehicles (AGV), robot control, and deep learning. *For main specifications, please download the catalog or check the website.

• Industrial PCs

VCOM-BASE, a carrier board compatible with the compact COM Express Type 6 in ATX form factor specifications.

The "VCOM-BASE," compliant with the COM Express Carrier Design Guide specifications, supports the compact COM Express Type 6 in an ATX form factor. With one each of PCIe x16, PCIe x4, and PCIe x1 expansion slots, as well as switchable Dual BIOS support, the "VCOM-BASE" is an ideal carrier board for all industrial embedded development. *Please download the datasheet or check our website for the main specifications. *You may also consider the COM Express Type 6 compatible Computer-On-Module (COM) VCOM-1600.

• Embedded Board Computers
• Embedded system design service
• Other embedded systems (software and hardware)

The EAC-3000, equipped to support up to 8 GMSL cameras (Fakra-Z connector), is ideal for various automotive applications.

The "EAC-3000," which is compact and equipped with the NVIDIA Jetson AGX Xavier, features 5 GigE LAN ports (4 of which are PoE+ LAN ports), 2 Digital Display ports, 4 USB 3.0 ports, and is fanless, supporting an extended temperature range from -20°C to 70°C. Additionally, it supports up to 8 automotive GMSL cameras (with Fakra-Z connectors), making it ideal for various automotive applications and AIoT applications. *For the main specifications, please download the catalog or check our website.*

• Image Processing Equipment
• Industrial PCs
• Embedded system design service

COM Express Type 6 compatible computer-on-module (COM) VCOM-1600

The "VCOM-1600," a computer-on-module (COM) equipped with the Intel Atom x6000E processor (Elkhart Lake) and compliant with COM Express Type 6, features a compact form factor (95mm x 95mm) and supports real-time data synchronization with Intel TSN/TCC standards. It enables 4K display output through various interfaces such as DDI, VGA, and LVDS. The "VCOM-1600" is the optimal COM Express solution for all embedded applications. *Please download the datasheet or check our website for the main specifications. *You may also consider the carrier board "VCOM-BASE," which complies with the COM Express Carrier Design Guide specifications.

• Embedded Board Computers
• Embedded system design service
• Other embedded systems (software and hardware)

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)