【Catalog now available!】Flexible, low-temperature curing epoxy adhesive【A-8530BKLC】

We would like to introduce our flexible one-component adhesive [A-8530BKLC] that can cure at low temperatures and has minimal changes in physical properties when heated. It is suitable for bonding low-heat-resistant components that require stress relaxation.
【Features】
■ Improved hardness changes during thermal history, which were an issue with conventional flexible epoxy adhesives, achieving a balance between flexibility and reliability during thermal history.
■ Can cure at low temperatures.
■ Low viscosity for excellent workability.
■ Also compliant with low halogen requirements.
Samples are available upon request.
For more details, please download the catalog or feel free to contact us through our website or the Ipros site.
↓↓↓↓ Download the catalog here! ↓↓↓↓
https://www.ipros.jp/catalog/detail/578374?hub=60+4649133

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