Anodic bonding device
Batch processing achieves low dew point. High-precision alignment can be performed in the atmosphere or in a vacuum. Changing the conditions of the joining atmosphere is easy. Since only the necessary parts are heated, distortion is minimal during joining. There is no variation between rods, resulting in good yield. Automation of operations allows for labor savings.
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basic information
It is a bonding device for sensor, micromachine, and SOI device material development. It is a device aimed at the development and production of new devices and sensors, composed of cleaning mechanisms, alignment mechanisms, heating mechanisms, and weighting mechanisms in a vacuum environment.
Price information
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Delivery Time
P4
Applications/Examples of results
Not entered
Company information
The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.