It is possible to join different metal materials that are difficult to weld, as well as to join complex shapes and small materials.
The "Diffusion Bonding Device" is a product that uses our unique vacuum technology to bond metal materials at the atomic level, allowing for the bonding of different materials as well. It minimizes material deformation, which is a common issue in welding, and enables multi-layer stacking, making high-precision processing and bonding of small materials possible. 【Features】 ■ Fine temperature control through programming ■ Bonding without melting the materials ■ Available for lease options *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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basic information
【Specifications】 Pressurization method: Weighting method using weights and a lever Overheating dimensions: 40φ×40H Overheating method: High frequency, programmable temperature control Maximum overheating temperature: 1400℃ Vacuum level: x10-5PA High frequency power supply: 20kW *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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For more details, please refer to the materials. Feel free to contact us as well.
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◇What's Great About Atotech◇ - Developed in university research labs and from a vacuum equipment manufacturer - Kind and thorough! Comprehensive repair system (staff with high product knowledge will handle it) - Reliable support when in trouble (we will contact you on the same day or the next day if you send us a fax or email) - Affordable and quick delivery (we deliver in a short period) - Small lot orders (we customize even for small quantities or small items) - A wide variety of products (from ready-made to custom orders) - Extensive delivery track record (to government agencies, companies, universities, research institutes, etc.)
![[Customer Interview] Nihon University College of Science and Technology](https://image.mono.ipros.com/public/product/image/307/2000800876/IPROS16259650929653306833.png?w=280&h=280)
