Surface active bonding device (room temperature bonding)
Surface Active Joining Device (Room Temperature Joining) SAB?60
Surface active bonding device (room temperature bonding). Bonding at low temperatures without using sealing materials!
●This is an optimal system for the development of next-generation MEMS devices and semiconductor packaging. ●It performs high-precision alignment and weight application in ultra-high vacuum. ●It allows for the bonding of dissimilar materials by directly bonding without heating the substrate. ●It is compatible with load lock systems and cluster systems.
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basic information
This is a device for bonding after activating the bonding surface of substrates such as silicon and compound semiconductors under ultra-high vacuum. It can bond at low temperatures without using sealing materials.
Price information
-
Delivery Time
P4
Applications/Examples of results
Substrate bonding applications
Company information
The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.
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