Hermetic seal with excellent airtightness, heat resistance, and insulation properties. From prototype to mass production.
The hermetic seal package and system composed of metal and glass exhibit excellent airtightness, heat resistance, and insulation, providing complete airtight protection for devices such as semiconductor elements and ensuring high reliability against various environments. Additionally, hermetic sealing and mouth attachment processing to Cu-W or Cu materials are also possible to improve heat dissipation.
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basic information
The hermetic seal package and system composed of metal and glass exhibit excellent airtightness, heat resistance, and insulation, providing complete airtight protection for devices such as semiconductor elements and ensuring high reliability against various environments. Additionally, hermetic sealing and mouth attachment processing to Cu-W or Cu materials for improved heat dissipation are also possible.
Price information
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Delivery Time
P4
Applications/Examples of results
Hermetic seal package and system composed of metal and glass.
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Company information
Fuji Denka is challenging itself with infinite technologies using glass and metal. In the fields of electronics, nanotechnology, and biotechnology that are paving the way for the 21st century, <FUJI-DENKA> contributes to the advancement of cutting-edge research areas. By integrating diverse technologies, we are boldly taking on new business ventures that nurture the next era and are committed to creative activities.