Total support from prototype to mass production. We provide highly reliable products.
◆Overview The plugin platform package is made of metal and glass, featuring excellent airtightness and insulation, and is used as a Dual In-Line Package (DIP) for insertion mounting on printed circuit boards. ◆Features - It can be supplied as a set with a cover (cap). - A representative overview diagram is provided below, but we also offer custom design and manufacturing, so please consult us separately. ◆Main Specifications Airtightness: 1×10^-9 Pa·m³/sec or less Insulation Resistance: 1000 MΩ or more at DC 500V between base and lead wires Finish: Ni-Ep / Ni-Elp + Au-Ep ★ For more details, please request documentation or download the catalog ★
Inquire About This Product
basic information
◆Overview The plug-in platform package is made of metal and glass, featuring excellent airtightness and insulation, and is used as a Dual In-Line Package (DIP) for insertion mounting on printed circuit boards. ◆Features - It can be supplied as a set with a cover (cap). - A representative overview diagram is provided below, but we also offer custom design and manufacturing, so please consult us separately. ◆Main Specifications Airtightness: 1×10^-9 Pa·m³/sec or less Insulation Resistance: 1000 MΩ or more at DC 500V between base and lead wires Finish: Ni-Ep / Ni-Elp + Au-Ep ★ For more details, please request materials or download the catalog ★
Price information
-
Delivery Time
Applications/Examples of results
-
catalog（1）
Download All Catalogs
Company information
Fuji Denka is challenging itself with infinite technologies using glass and metal. In the fields of electronics, nanotechnology, and biotechnology that are paving the way for the 21st century, <FUJI-DENKA> contributes to the advancement of cutting-edge research areas. By integrating diverse technologies, we are boldly taking on new business ventures that nurture the next era and are committed to creative activities.
