MIL-STD-883 compliant products are also available! High airtightness and high insulation.
【Overview】 These packages are made of metal and glass, offering excellent airtightness and insulation properties. They are used in surface mount type packages for HIC, among others. 【Main Features】 ● Airtightness: 1×10^-9 Pa·m³/sec or less ● Insulation Resistance: Over 1000 MΩ at DC 500V between base and lead wires. ● Finish: Ni-Ep / Ni-Elp + Au-Ep
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【Overview】 These packages are made of metal and glass, offering excellent airtightness and insulation. They are used in surface mount type packages for HICs, among others. 【Main Features】 ● Airtightness: 1×10^-9 Pa·m³/sec or less ● Insulation resistance: Over 1000 MΩ at DC 500V between base and lead wires. ● Finish: Ni-Ep / Ni-Elp + Au-Ep
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● Evaluation compliant with MIL-STD-883 standards is also available. ● We can provide it as a set with a lid (cover). ● A typical overview diagram is shown below, but we also offer custom design and manufacturing, so please consult us separately.
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Fuji Denka is challenging itself with infinite technologies using glass and metal. In the fields of electronics, nanotechnology, and biotechnology that are paving the way for the 21st century, <FUJI-DENKA> contributes to the advancement of cutting-edge research areas. By integrating diverse technologies, we are boldly taking on new business ventures that nurture the next era and are committed to creative activities.