Bump for flip chip bonding
Various bump processing for flip chip mounting
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basic information
● Plating bump Au bump (bump pitch 20μm) Solder bump (bump height 100μm) Cu pillar bump (bump height 100μm, pitch 80μm) ● Au stud bump (bump pitch 40μm) ● Solder printing (bump height 150μm)
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Applications/Examples of results
【Applications and Examples of Achievements】 - LCD Driver IC - High-Frequency Devices - Communication Devices - MPU - Image Processing Devices 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."