Electrostatic resist.
Patterns can also be created on three-dimensional shapes, including facets and edges (corners).
Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.
3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies such as MENS devices, techniques for processing complex and delicate patterns in three-dimensional structures are required. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.
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■□■Features■□■ ■A uniform resist film can be formed on conductive surfaces. ■Photochemical etching can be applied to the entire three-dimensional shape, including edges and corners. ■By combining plating and electrodeposition resist technologies, the semi-additive method can also be applied to three-dimensional substrates. ■For more details, please contact us.
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■□■Purpose■□■ Contributing to prototyping and development in various fields, including microelectronics products and optical products.
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Photo Precision Co., Ltd. is a company that contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. Next-generation industrial core products such as MEMS (Micro Electro Mechanical Systems), biochips, and microchemical chips are formed by the complex application of technologies such as nanotechnology, three-dimensional micromachining, high-density three-dimensional packaging, and three-dimensional photolithography. Photofabrication is deeply involved in all of these technologies and serves as the foundational technology for MEMS development. We strive for continuous technical improvement with the support of our customers, while also introducing advanced equipment as much as possible to meet the diverse needs of our clients.