Electroplating
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. ■□■ Features ■□■ ■ Introduction of a plating system compatible with 6-inch wafers ■ While film formation by vapor deposition is usually less than 1μm, plating can form films of several μm ■ Suitable for processing three-dimensional shapes ■ As a metal film, it can be used for circuit formation requiring specific film thicknesses or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■ For other functions and details, please download the catalog or contact us.
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Photo Precision Co., Ltd., which contributes to prototyping and development in various fields including microelectronics and optics, with photofabrication as its core technology, presents information on "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the solution to deposit metal onto the surface of the substrate. ■□■Features■□■ ■Introduction of a plating system compatible with 6-inch wafers ■While film formation by vapor deposition is usually below 1μm, plating can form films of several μm ■Suitable for processing three-dimensional shapes ■As a metal film, it can be used for circuit formation requiring specific film thickness or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■For other functions and details, please download the catalog or contact us.
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■□■Application■□■ Precision Machining Industry
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Photo Precision Co., Ltd. is a company that contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. Next-generation industrial core products such as MEMS (Micro Electro Mechanical Systems), biochips, and microchemical chips are formed by the complex application of technologies such as nanotechnology, three-dimensional micromachining, high-density three-dimensional packaging, and three-dimensional photolithography. Photofabrication is deeply involved in all of these technologies and serves as the foundational technology for MEMS development. We strive for continuous technical improvement with the support of our customers, while also introducing advanced equipment as much as possible to meet the diverse needs of our clients.
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