FPC & TAB・COF manufacturing equipment

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last updated：Feb 25, 2015

進和工業本社工場

Official site

We will introduce the wet equipment for manufacturing FPC (Flexible Printed Circuit Boards) and TAB/COF.

This is a prototype of a roll-to-roll and reel-to-reel device that our company specializes in. It is a surface treatment device that continuously processes flexible substrates.

Inquire About This Product

basic information

This is a TAB/COF manufacturing device that performs surface treatment using a reel-to-reel method and an FPC manufacturing device that performs surface treatment using a roll-to-roll method. It is a device that forms metal circuits on flexible substrates using subtractive or additive methods. It can accommodate various flexible substrate surface treatment processing devices, such as general-purpose FPC substrates with copper foil laminated from tape substrates with widths of 35 to 158 mm, and aluminum foil laminated substrates with widths of 700 to 1,200 mm, like TAB/COF. We also manufacture processing devices for two-layer substrates laminated with transparent conductive films and metal thin films, as well as metallizing devices for various clad substrates. Regarding roll-to-roll devices, the photolithography process can be observed at our affiliated company, Window Touch Co., Ltd. We can also accommodate evaluation tests before equipment installation. Please feel free to contact us.

Price information

8 million yen and up. The price varies depending on the scale of the equipment. Please contact us for inquiries.

Price range

Delivery Time

Please contact us for details

※Delivery time varies between 45 to 120 days depending on the scale of the equipment.

Applications/Examples of results

【Applications】 1. Surface treatment equipment for TAB tape substrates 2. Surface treatment equipment for general-purpose flexible substrates 【Examples of Achievements】 - Pre-treatment and resist coating equipment - Dip-type resist coating equipment - TAB carrier tape cleaning equipment - Chemical polishing equipment - Electroplating equipment - Electroless plating equipment - Etching photoresist developing equipment - Solder resist developing equipment - Etching equipment (copper, aluminum, seed layer) - Resist stripping equipment, etc.

Detailed information

PSR developing device This is a photosensitive solder resist (PSR) developing device for TAB/COF/T-BGA. It is capable of processing four carrier tapes simultaneously.
Wet device for TAB/COF This is a view of a 4-unit type wet equipment for TAB/COF/T-BGA manufacturing from the unwind side.
TAB tape product example This is the transport section of the TAB tape. This device can process two at the same time.
Auxiliary drive (intermediate drive) In devices with long processing steps, such as plating equipment, there may be cases where an auxiliary drive mechanism, as shown in the diagram, is provided in the intermediate process.
RTR-type electroplating device for copper. It is a roll-to-roll electroplating device using insoluble anodes.
Wet Processing Section (Cell Structure) This is the chemical and water washing treatment section for wet devices used in TAB/COF. It is designed to prevent damage to the thin film substrate with fine wiring formed on it.
RTR Electroless Gold Plating Device It is a reel-to-reel type electroless gold plating device.
TAB/COF Device Product Winding Section This is a diagram of the winding unit of a 4-line TAB/COF manufacturing device. This device is equipped with an accumulator.
Main Drive Unit for TAB Tape This is the main drive unit that transports various TAB tape substrates with widths ranging from 35 to 158 mm. To reduce the transport load, the guide rollers with a larger diameter are designed to be lightweight.