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  6. Synthesis of polyimide film and improvement of high adhesion and low rebound elasticity, along with surface analysis.

Synthesis of polyimide film and improvement of high adhesion and low rebound elasticity, along with surface analysis.

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last updated:Feb 13, 2020

AndTech
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★Synthesis of polyimide films, enhancement of adhesion, thin film formation, low rebound elasticity, latest research topics

【Lecturers】Part 1: Mr. Hiroki Ishikawa, Development Division, Capton Technology and Development Department, Toray DuPont Co., Ltd. Part 2: Mr. Yoshitsugu Nakagawa, Director, Surface Analysis Laboratory, Surface Science Research Department, Toray Research Center, Inc. 【Venue】Kawasaki City Educational and Cultural Center, Room 2【Kanagawa, Kawasaki】 【Date and Time】December 16, 2010 (Thursday) 13:00 - 16:15 For those considering confirming details or applying, please use the URL ⇒ http://ec.techzone.jp/products/detail.php?product_id=1265

    Technical Seminar
002426[1].jpg

Synthesis of polyimide film and improvement of high adhesion and low rebound elasticity, along with surface analysis.

002426[1].jpg
002426[1].jpg
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【Lecture Summary】 This presentation will introduce polyimide films, which are widely used as flexible circuit substrates due to their characteristics such as electrical insulation, heat resistance, flame retardancy, and flexibility. General topics will include synthesis methods, properties, and examples of use. Additionally, recent developments such as improved adhesion, low-rebound elasticity, and thin-film technology will be discussed. 【Lecture Summary】 The surface of polymer films is closely related to properties such as wettability, adhesion, and slip resistance. Therefore, the analysis and evaluation of surfaces hold practical significance. This lecture will explain the principles and applications of X-ray photoelectron spectroscopy (XPS), Fourier-transform infrared spectroscopy (FT-IR), and time-of-flight secondary ion mass spectrometry (TOF-SIMS), which are used for analyzing polymer film surfaces. Furthermore, examples of applications will be presented, including results investigating the relationship between the adhesion and structure (such as interfacial reactions) of copper/polyimide interfaces, as well as depth profile analysis results of polyimide films subjected to pre-treatment for copper plating.

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47250 42000

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P2

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P2

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Part 1: Enhancement of Adhesion and Improvement of Resilience of Polyimide Film [13:00-14:30] Part 2: Polymer Surface Analysis Methods and Surface Modification/Adhesion Evaluation of PI Film [14:45-16:15] Mr. Yoshitsugu Nakagawa, Toray Research Center, Inc.

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Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.

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