Exposure device MJB4

Zuse Microtech Co., Ltd. will exhibit at the "22nd Micromachine/MEMS Exhibition" held at Tokyo Big Sight in Ariake from July 13 (Wednesday) to 15 (Friday). Please visit us at Booth B-05 in Hall 2. We will introduce wafer processing equipment for MEMS, LEDs, and 3D packaging, including mask aligners, resist coating/developing equipment, wafer bonding equipment, and temporary bonding/debonding equipment. We plan to showcase samples such as wafer debonding for thinning and metal bonding for high-brightness LEDs. Additionally, in collaboration with Tanaka Precious Metals Co., Ltd., we will also exhibit wafer bonding technology using submicron Au particles. In the accompanying exhibitor presentation, titled "Advanced Lithography and Wafer Bonding Technology - Advanced MEMS, High-Brightness LEDs, and Thin Wafer Transport," we will mainly introduce wafer bonding technology for advanced MEMS and high-brightness LEDs. We invite you to join us on July 14 (Thursday) from 14:40 to 15:30 in the exhibitor presentation room (next to the entrance on the East 1 Hall side).