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  1. Home
  2. Electronic Components and Semiconductors
  3. ズース・マイクロテック
Electronic Components and Semiconductors
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ズース・マイクロテック

EstablishmentJanuary 1, 1988
capital3000Ten thousand
number of employees10
addressKanagawa/Kohoku-ku, Yokohama-shi/5th Floor, Benex S-3, 3-20-8 Shin-Yokohama
phone045-475-3556
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last updated:Dec 04, 2023
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  • Products/Services(10)
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ズース・マイクロテック Company Profile

Zeus Microtech's wafer process equipment is widely used in the development and manufacturing of MEMS, LEDs, power semiconductors, and three-dimensional stacking.

Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.

Business Activities

Proposal of semiconductor manufacturing equipment and technology, as well as related process/solution development. Handled equipment: - Ultraviolet exposure equipment (mask aligner) - Resist coating and developing equipment (spin & spray coater) - Wafer bonding equipment (wafer bonder) - Photomask cleaning equipment Related technology fields: - MEMS - LED - Advanced packaging - Three-dimensional stacking - Power semiconductors - Nanotechnology ■ Sales and distribution of equipment, as well as installation and maintenance, are conducted by the domestic general agent, Kanematsu PWS Corporation (045-544-1811).

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Products/Services (10)

Fully Automatic Wafer Bonder XBS200 product image
Fully Automatic Wafer Bonder XBS200
High-Load Wafer Bonder XB8 product image
High-Load Wafer Bonder XB8
Universal Wafer Bonding Device SB6/8 Gen2 product image
Universal Wafer Bonding Device SB6/8 Gen2
Wafer Detachment Device DB12T product image
Wafer Detachment Device DB12T

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catalog(1)

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Zuse Microtech Co., Ltd. Product Information (English Version)

Zuse Microtech Co., Ltd. Product Information (English Version)

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news(10)

[Ended] On June 22 (Friday), at the Science & Technology Company seminar "Changing Semiconductor Packaging," I will give a presentation titled "Latest Trends in Temporary Bonding and Debonding Technologies for FO-WLP."

  • SEMINAR_EVENT

On June 22, 2018 (Friday), I will give a presentation titled "Latest Trends in Temporary Bonding and Debonding Technology for FO-WLP" at the Science & Technology Company seminar "Changing Semiconductor Packaging." 1. Application of Temporary Bonding/Debonding Technology to FO-WLP 1.1 Background of Temporary Bonding/Debonding Technology 1.2 Applications of Temporary Bonding/Debonding Technology 1.3 Basic Processes of 2.5D/3D Stacking 1.4 Basic Processes of FO-WLP 2. XBS300 Bonding Equipment 2.1 XBS300 Platform 2.2 Support for Warped Wafer Transport 3. XBC300 Gen2 Debonding and Cleaning Equipment 3.1 XBC300 Gen2 Platform 3.2 Mechanical Debonding 3.3 Laser Debonding 3.4 Cleaning Equipment Compatible with Tape Frames 3.5 Detaper 4. Conclusion 5. Q&A Session

Jul 02, 2018

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XBS200_MG_7683_bearb_Original_6144.jpg

【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).

  • SEMINAR_EVENT

We will be exhibiting at the MEMS Engineer Forum 2018 (April 25 (Wed), 26 (Thu); KFC Hall (Tokyo, Ryogoku)). We look forward to your visit.

Feb 19, 2018

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[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).

  • SEMINAR_EVENT

We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.

Feb 19, 2018

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Detailed information

Company name ズース・マイクロテック
number of employees10
Contact addresspostalcode 222-0033 Kanagawa/ Kohoku-ku, Yokohama-shi/ 5th Floor, Benex S-3, 3-20-8 Shin-YokohamaView on map TEL:045-475-3556 FAX:045-474-2885
Industry Electronic Components and Semiconductors
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