Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.
【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.
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basic information
The SB6/8 Gen2 is a semi-automatic platform that supports a variety of bonding processes and can handle various sizes and types of wafers and substrates up to 200mm, making it a flexible tool suitable for diverse applications and process environments. It is used in a wide range of fields, including device fabrication for MEMS, LEDs, advanced packaging, and 2.5D/3D stacking, as well as wafer-level packaging. With the SB6/8 Gen2, the transition from research and development to pilot production and then to mass production can be carried out smoothly. □ For more details, please refer to the catalog.
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Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.