[Completed] JMS Seminar "Development Trends of FO-WLP - Process, Sealing, Temporary Bonding, Materials"

At the technical seminar "Development Trends of FO-WLP - Process, Sealing, Temporary Bonding, Materials" hosted by JMS (Japan Marketing Survey Co., Ltd.), I will give a presentation on the temporary bonding/peeling technology of Zeus Microtech.
The seminar will provide detailed explanations on various topics, including an overview of FO-WLP, process element technologies (sealing, temporary bonding/peeling), materials, and noteworthy development technologies such as wafer scaling and application-specific deployment, addressing challenges and initiatives for future market expansion from the perspectives of semiconductor and packaging companies, equipment manufacturers, and material vendors.

Date and time | Wednesday, Jul 27, 2016 10:00 AM ~ 04:30 PM |
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Capital | Kōwa Kaikan (1-2-10 Yanagibashi, Taitō-ku, Tokyo) |
Entry fee | Charge 49,800 yen per person (including text and lunch) |
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