A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.
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basic information
For more details, please contact the person in charge at our Bonding Division (045-475-3556).
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Applications/Examples of results
■ 2.5D interposer ■ 3D stacking ■ Advanced MEMS ■ Power semiconductors
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Company information
Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.