[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Wafer processing/polishing equipment
• Bonding Equipment

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Nakakin will be exhibiting at 'FOOMA JAPAN 2026 (International Food Industry Exhibition)' held at Tokyo Big Sight. This exhibition proposes "A rich future opened by food technology" through cutting-edge technology, products, and services in food machinery, amidst growing interest in "food safety and security." We aim to facilitate the exchange and dissemination of technology and information related to food machinery, equipment, and associated devices, contributing to the further development of the food industry. We sincerely look forward to your visit.

[Speaker] Academic Visitor, University of Strathclyde, UK Visiting Professor, Offshore Wind Research and Education Center, Kyushu University Senior Researcher, Institute for Sustainable Energy Policies (ISEP) Mr. Yo Yasuda [Lecture Topics] 1. International Trends in Decarbonization and Japan's Position (1) Risks of Fossil Fuel Dependence and Decarbonization as Risk Management (2) Discussions on Decarbonization and Renewable Energy in International Organizations (3) Discussions on Decarbonization and Renewable Energy in Japan (4) Discrepancies Between International and Domestic Discussions (The U.S. is not the world) 2. International Discussions on Large-Scale Introduction of Renewable Energy (1) Electrification and Sector Coupling (Why are EVs and Heat Pumps Advancing?) (2) Externalities and Benefits (Long-Term Perspective and Risk Management) (3) Flexibility (The notion that "renewable energy is unstable" is outdated) 3. Challenges and Solutions for Japan, Methodology for Information Gathering (1) Fake News and Scientific Methodology (2) Non-Scientific Narratives and Evidence-Based Policy Making (EBMP) (3) AI and Specialized Information Retrieval 4. Q&A / Business Card Exchange *Reference: "The Future of 90% Renewable Energy by 2050 - Scenarios and Scientific Basis for Achieving Decarbonization" by Yo Yasuda, Yamato Keikokusha (December 2024)

[Speaker] Akira Yamauchi, President and CEO of Intellectual Property Landscape Co., Ltd. Patent Attorney, AIPE Certified Senior Intellectual Property Analyst [Lecture Topics] 1. What is Physical AI? [1] Industrial Robots [2] Humanoids [3] Autonomous Vehicles as the main fields Overview of the population setting for the three fields and the key players in each field 2. [1] Industrial Robot Analysis 3. [2] Humanoid Analysis 4. [3] Autonomous Vehicle Analysis 5. Summary and Discussion of the Analysis Results for the Three Fields 6. Q&A Session