[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Wafer processing/polishing equipment
• Bonding Equipment

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

[Speaker] Daisuke Imaizumi, President and CEO, Infra Commons Inc. [Key Lecture Content] The "Software-Defined Warfare" led by the U.S. Department of Defense is establishing a new model of warfare centered on AI, autonomous drones, and real-time command and control. This seminar will explain the U.S. strategic shifts, including the Replicator concept, JADC2, and the rise of Palantir and Anduril, while delving into the essence of the structural transformation facing Japan's defense industry. Through the establishment of Anduril's Japanese subsidiary, the "purely domestic drone" concept, and Palantir's data infrastructure and generative AI deployment, we will present how companies like Mitsubishi Heavy Industries, Kawasaki Heavy Industries, Fujitsu, and NEC can play a central role in Japan-U.S. collaboration. We will provide practical insights for existing industries to carve out paths as "co-creation partners" rather than "enemies" in the AI and software-driven era. This is a must-see lecture for rethinking the future of the defense industry.

[Key Lecture Content] 1. Quantum Technology Opening the Future: The Cutting Edge of Quantum Communication Promoted by the Ministry of Internal Affairs and Communications Yuichiro Yano, Deputy Director, Research Promotion Office, Technology Policy Division, International Strategy Bureau, Ministry of Internal Affairs and Communications 1. Basics of Quantum Technology and the Role of the Ministry of Internal Affairs and Communications 2. The Future Brought by Quantum Technology and Government Strategy 3. Research and Development and Quantum Security Bases 4. Social Implementation of Quantum Technology and Use Cases 5. International Initiatives and Future Prospects 6. Q&A / Business Card Exchange 2. The Value and Potential of Quantum Cryptography in the Post-Quantum Era Go Kato, Director, Quantum ICT Research Laboratory, Future ICT Research Institute, National Institute of Information and Communications Technology 1. The Origin of the Security of Quantum Cryptography 2. Current Status of Quantum Cryptography Devices 3. Current Issues and Potential of Quantum Cryptography Technology 4. Long-term Prospects for Future Technological Development of Quantum Cryptography 5. Q&A / Business Card Exchange

[Key Lecture Content] 1. Trends and Future Prospects of Physical AI Hiroshi Kondo, Deputy Director and Expert, Advanced Technology Lab, Japan Research Institute, Ltd. 1. What is Physical AI? 2. Technological trends of generative AI behind Physical AI 3. Examples and research trends of Physical AI 4. Future prospects 5. Q&A / Business card exchange 2. The Future Opened by Physical AI: NVIDIA's Initiatives and Prospects Ken Arai, Senior Manager, Robotics Developer Relations, Enterprise Business Division, NVIDIA Corporation 1. What does NVIDIA perceive as "Physical AI"? 2. Accelerated computing supporting technological evolution 3. The role of digital twins and the importance of synthetic data generation 4. Learning and inference of Physical AI models 5. Implementation examples of Physical AI 6. Q&A / Business card exchange

We are pleased to announce the archive distribution of our seminar titled "New Plan 'Mojitori Plus' Debuts! From Paper to Data! The First Step in Internal DX with Mojitori." 'Mojitori' allows you to convert text from photos, images, PDF files, and more into data, automatically inputting it into various fields in kintone. In this seminar, we will clearly explain the basic functions and usage of Mojitori. Additionally, we will provide detailed explanations about the Plus plan and the document-focused Mojitori, which were added in the major update in November. 【Recommended for】 - Those who are struggling with frequent transcription errors due to manual data entry. - Those who wish to digitize documents currently stored on paper. 【Timetable】 - Overview of Mojitori's functions - Overview of Mojitori Plus's functions - Details and pricing of each plan - Q&A session We look forward to your registration.

Innovating material development at the nano level through high-speed molecular simulation and machine learning With the advancement of molecular simulation technology, it has become possible to handle nano-level phenomena through computer simulations. Additionally, the combination of simulation and machine learning is expanding the range of possibilities. Schrödinger supports the enhancement of analytical power, efficiency, and reduction of development time in your material development using the latest molecular simulation and machine learning technologies, as well as techniques that integrate both. At our exhibition booth, specialized technicians will explain the latest technologies and answer questions from attendees. *During the event, we will hold a seminar at our booth. Theme: "Seeing Inside Materials at the Nano Level" - New Material Development through Simulation and Machine Learning We will introduce examples of predicting physical property values of various materials on a computer. You can experience each software firsthand. 【Exhibition Information】 Exhibition Name: nano tech Dates: January 28-30, 2026 Venue: Tokyo Big Sight, West Hall 3 Booth Number: 3W-H07 Exhibition Zone: [Materials] Material Zone