200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.
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basic information
■ Compatible wafer sizes: 100 mm, 150 mm, 200 mm ■ Load: 60 kN (standard), 100 kN (optional) ■ Heater temperature: ≤ 550 °C ■ Chamber pressure: 5x10-5 mbar to 3 bar ■ Heating/cooling rate: Heating 40 K/min, cooling up to 40 K/min ■ Compatible bonding processes: ・ Metal diffusion bonding ・ Eutectic bonding, TLP bonding ・ Adhesive bonding ・ Fusion bonding
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Applications/Examples of results
■ Advanced MEMS ■ 3D stacked devices ■ LED
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Company information
Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.