Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.
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basic information
【Features】 ● Chip flipping mechanism ● Compatible with thermal compression bonding method (by exchanging crimping head) ● Compatible with COF and COG substrates ● Alignment accuracy: ±5μm (optional ±1μm) ● High-precision head pressing mechanism using servo motor ● Built-in heater ultrasonic head ● Compatible with small to multi-pin by exchanging heads ● Automatic transport system for mass production (optional)
Price information
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Applications/Examples of results
【Applications】 ● LCD driver IC mounting (COF/COG substrates) ● LD and high-brightness LED mounting ● RFID mounting ● Development of mounting methods ● Material development ● Small quantity and multi-variety cell production 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://www.welljp.co.jp/fcb.html Company Information http://www.welljp.co.jp/
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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