High-performance flip chip bonder for multi-variety cell production lines.
By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.
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basic information
Small Pin - A compact tabletop flip chip bonder designed for cell production applications compatible with multiple pin chips.
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Applications/Examples of results
【Applications】 ● LCD driver IC mounting (COF/COG substrates) ● High-frequency devices ● Discrete ICs ● Mounting technology development ● LED mounting ● Multi-variety cell production applications 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-led.jp/flipchip.aspx Company Information http://www.welljp.co.jp/
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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